Forming methods of testing needle head and semiconductor testing clamp

Abstract

Provided are forming methods of a testing needle head and a semiconductor testing clamp. The forming method of the testing needle head comprises the steps that a substrate is provided; a first testing needle is formed in the substrate, and the first testing needle comprises a first testing end placed at the top and a first connecting end placed at the bottom; an insulation layer is formed on the side wall of the first testing needle; and a second testing needle is formed in the surface of the insulation layer, the second testing needle surrounds the first testing needle and comprises a second testing end placed at the top and a second connecting end placed at the bottom, and the second testing end of the second testing needle is provided with a downward-concave first arc face. According to the testing needle head formed with the method, testing on a spherical terminal to be tested is achieved, and testing accuracy is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a method for forming a test needle and a semiconductor test fixture. Background technique [0002] The test process is to test the electrical function of the packaged product after the IC is packaged to ensure the integrity of the IC function in the factory, and to classify the tested products according to their electrical function as an evaluation of different grades of IC products. According to the basis, and finally the appearance inspection of the product. [0003] The electrical function test is to test various electrical parameters of the product to ensure that the product can work normally. [0004] The traditional two-point contact test on the same terminal under test, such as the Kelvin test, mostly uses double thimbles or double golden fingers in parallel, which mainly has the following shortcomings: [0005] 1. Low manufacturing accuracy: With the conti...

AI Technical Summary

Problems solved by technology

[0005] 1. Low manufacturing accuracy: With the continuous shrinking of the size of semiconductor products, the size of the terminals to be tested and the distance between different terminals to be tested are also shrinking. In order to comply with this trend, the traditional double thimble or double gold The bottleneck of the finger test method is becoming more and more prominent in the problem of fine spacing, and the accuracy requirements are getting higher and higher, and some of them cannot even be realized.

[0006] 2. The structural strength is weak: in order to realize the two-point contact test in the limited space on the terminal under test, the thimble or golden finger is correspondingly thinner and its mechanical structural strength is also weaker and weaker.

[0007] 3. The service life is short: the test contact head of the traditional thimble or golden finger is more susceptible to wear, especially when the precision is higher and the mechanical strength is relatively low, the degree of wear is greater, thereby reducing the service life of the test fixture

[0008] 4. The test accuracy is low: In order to meet the development needs of semiconductors, the resistance value generated by thinner and thinner thimbles or golden fingers continues to increase. Affect the judgment of the test value; on the other hand, the double thimbles or double gold fingers distributed in parallel are also prone to deviations in the test values ​​due to the displacement deviation between the two; The contact method with two back-to-side slopes is adopted, the contact head is easy to rotate out of the terminal under test due to the torsion force of the spring in the overall structure, thereby affecting the test accuracy; on the other hand, when the terminal under test is spherical, it is difficult to carry out Electrical performance test

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