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Organosilicone modified epoxy resin and preparation method thereof as well as mica capacitor

A technology of epoxy resin and silicone, applied in the direction of fixed capacitor dielectric, fixed capacitor parts, etc., can solve the problem of restricting spaceflight and achieve the effect of improving the working height

Inactive Publication Date: 2015-01-28
卢儒
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Severely limit the performance improvement of aerospace and aviation ignition devices, reliable high temperature operation and reliable working height

Method used

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  • Organosilicone modified epoxy resin and preparation method thereof as well as mica capacitor
  • Organosilicone modified epoxy resin and preparation method thereof as well as mica capacitor
  • Organosilicone modified epoxy resin and preparation method thereof as well as mica capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1: The organosilicon-modified epoxy resin of this implementation, by mass parts, comprises the following components:

[0024]

[0025] A method for preparing the above-mentioned organosilicon-modified epoxy resin, comprising the following steps:

[0026] In terms of parts by mass, add 100 parts of bisphenol A epoxy resin, 2 parts of dibutyltin dilaurate and 0.5 part of KH550 into the reaction vessel, heat up to 110°C, and drop 30 parts of diphenyl Silanediol, and stirred and reacted for 5 hours in a constant temperature heating device to obtain a light yellow translucent liquid, that is, a silicone-modified epoxy resin.

Embodiment 2

[0027] Embodiment 2: The organosilicon-modified epoxy resin of this implementation comprises the following components in parts by mass:

[0028]

[0029] A method for preparing the above-mentioned organosilicon-modified epoxy resin, comprising the following steps:

[0030] In parts by mass, add 100 parts of bisphenol A epoxy resin, 2.5 parts of dibutyltin dilaurate and 1 part of KH550 into the reaction vessel, heat up to 120°C, and drop 40 parts of diphenyl silicon within 1 hour diol, and stirred and reacted in a constant temperature heating device for 6 hours to obtain a light yellow translucent liquid, that is, a silicone-modified epoxy resin.

Embodiment 3

[0031] Embodiment 3: The organosilicon-modified epoxy resin of this implementation, by mass parts, comprises the following components:

[0032]

[0033] A method for preparing the above-mentioned organosilicon-modified epoxy resin, comprising the following steps:

[0034] In terms of parts by mass, add 100 parts of bisphenol A epoxy resin, 3 parts of dibutyltin dilaurate and 2 parts of KH550 into the reaction vessel, heat up to 130°C, and drop 60 parts of diphenyl silicon within 2 hours diol, and stirred and reacted in a constant temperature heating device for 7 hours to obtain a light yellow translucent liquid, that is, a silicone-modified epoxy resin.

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PUM

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Abstract

The invention provides organosilicone modified epoxy resin and a preparation method thereof as well as a mica capacitor of a spacecraft. The organosilicone modified epoxy resin comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 30-60 parts of diphenyl silanediol, 2-3 parts of a catalyst and 0.5-2 parts of a coupling agent. The reliable operating temperature of the mica capacitor of the spacecraft prepared from organosilicone modified epoxy resin as a mica paper impregnated material is improved to over 55 DEG C and can reach over 180 DEG C. The reliable operating height of the mica capacitor of the spacecraft can be improved by three times and reaches over 15000m; under 6000V D. C breakdown voltage, the percent of pass can reach over 97%.

Description

technical field [0001] The technical field of epoxy resin of the present invention, in particular relates to a kind of organosilicon modified epoxy resin and its preparation method and spacecraft mica capacitor. Background technique [0002] The existing mica paper capacitors use mica paper impregnated with epoxy resin as the main medium. Due to the limitation of the working temperature of the epoxy resin used, the reliable working temperature of the capacitor can only reach 125°C. In the high-altitude environment, the atmospheric pressure is low, and the welding place between the capacitor core group and the lead wire is easy to breakdown and discharge. The reliable working height of existing mica paper capacitors can only reach 5000m. Seriously limit aerospace, aviation ignition device, the improvement of reliable high temperature work and reliable working height performance. Contents of the invention [0003] In view of this, one aspect of the present invention provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08L63/00H01G4/20
Inventor 卢儒
Owner 卢儒
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