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Base resin for soldering flux, soldering flux and solder paste

A basic resin and flux technology, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of easy loss of electronic components, loss of adhesion, reduced fluidity, etc., and achieve excellent stability over time , Viscosity stability is small, the effect of improving color tone and crack resistance

Active Publication Date: 2015-01-28
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, fluxes containing this rosin tend to show reduced fluidity over time
Additionally, it has been shown that solder pastes containing this flux can become increasingly viscous and tend to lose their cohesion over time; that is, tend to lose their ability to hold electronic components in a reflow oven

Method used

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  • Base resin for soldering flux, soldering flux and solder paste
  • Base resin for soldering flux, soldering flux and solder paste
  • Base resin for soldering flux, soldering flux and solder paste

Examples

Experimental program
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Effect test

preparation example Construction

[0041] The production method of ingredient (A) is not particularly limited, and various known methods can be used. Specific examples include the following methods 1 to 3 described below.

[0042] 1. A method comprising: purifying raw rosin (for example, gum rosin, wood rosin, tall oil rosin); and subjecting the purified product to a hydrogenation reaction and / or disproportionation reaction, thereby producing a component (a-1) containing a predetermined amount Component (A) to (a-3). In this method, rosin containing certain amounts of components (a-1) and (a-2) is preferably used as a raw material rosin, and such rosin can be identified by referring to academic literature known at the time of filing this application.

[0043] 2. A method comprising: purifying raw rosin; carrying out hydrogenation reaction and / or disproportionation reaction to the purified product, thereby preparing rosin containing a predetermined amount of component (a-3); adding a predetermined amount of com...

Embodiment

[0078] Hereinafter, the present invention is described in detail by way of Examples and Comparative Examples. However, it goes without saying that the scope of the present invention is not limited to the examples. The symbols "part" and "%" are by weight.

[0079] The compositional ratios of resin acids shown in Table 1 and Table 2 were measured by using a commercially available gas chromatography mass spectrometer (manufactured by Agilent Technologies, trade names "Agilent 6890" and "Agilent 5973N"). A commercially available column (manufactured by Shinwa Chemical Industries Ltd., trade name "Advance-DS") was used.

[0080] Preparation of Rosin (A)

preparation example 1

[0082] 185 g of Argentinian gum rosin (indicated as "raw material 1" in Table 1; Table 1 shows the raw materials of the following examples in the same manner) was placed in a vacuum distillation vessel, and was distilled under reduced pressure at 0.4 kPa in a nitrogen atmosphere , thus obtaining purified rosin. Subsequently, 150 g of purified rosin and 0.7 g of 5% palladium carbon (water content: 50%) were placed in a 0.3 L rotary autoclave, and oxygen in the system was removed, followed by pressurization to 10 MPa with hydrogen. The temperature was raised to 220° C., and a hydrogenation reaction was performed at the same temperature for 3 hours, thereby obtaining rosin (A1). Table 1 shows the composition ratio of the resin acids contained in the raw material rosin (raw material 1) and Table 2 shows the composition ratio of the resin acids contained in the rosin (A1) and the physical properties of the rosin (A1) (Table 1 and Table 1). 2 also shows the composition ratio of the...

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Abstract

The present invention addresses the problem of providing a novel base resin for a soldering flux, said novel base resin being capable of improving the fluidity of a flux, the viscosity stability and tackiness of a solder paste, and the color tone and crack resistance of a flux residue. This novel base resin comprises a rosin (A) containing: at least 15wt% of a pimarane-type resin acid (a-1); at least 1wt% of a labdane-type resin acid (a-2); and at least 50wt% of an abietane-type resin acid (a-3) that does not have any conjugated double bond.

Description

technical field [0001] The present invention relates to a base resin for flux, flux and solder paste. Background technique [0002] Surface mounting on circuit boards generally involves the following steps. Electronic components such as capacitors are subsequently mounted on circuit boards by supplying solder paste, which is a mixture of flux and solder powder, to electrodes on circuit boards using techniques such as screen printing and dispenser extrusion. The circuit board is then heated in a reflow oven to melt the solder powder, thereby connecting the electronic components and the electrodes. [0003] Natural rosin has been widely used as a base resin for fluxes. However, due to the presence of a large number of abietane-type resin acids (for example, abietic acid, levopimaric acid, and palustric acid) containing conjugated double bonds in the molecule, natural rosin is extremely easy to oxidize, so natural rosin shows a lower thermal conductivity. Stability (e.g., te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L93/04B23K35/363B23K35/26
CPCB23K35/26B23K35/362C08L93/04B23K35/3613B23K35/025Y10S516/925
Inventor 舟越靖中谷隆吉本哲也
Owner ARAKAWA CHEM IND LTD
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