Thermal control device of spaceborne radar emission receiver chip component

Abstract

The invention discloses a thermal control device for a spaceborne radar transmitting and receiving chip assembly, comprising: the transmitting and receiving chip assembly [4] is installed in the heat pipe area of ​​a honeycomb plate; the space between the transmitting and receiving chip assembly [4] and the honeycomb plate is filled with thermally conductive fillers ; The outer surface is sprayed with radiation coating; on the corresponding side, an electric heater [3] and a loop heat pipe LHP evaporator [8] are pasted; a temperature sensing element [6] is installed on the transmitting and receiving chip assembly [4], connected by a wire to the input end of the control device [13]; the output lines of the control device [13] are respectively connected with the LHP evaporator [8] and the electric heater [3]; the exterior of the honeycomb panel is equipped with heat insulating material; the back of the heat insulating material An LHP radiator [9] is installed on the sunny side; the LHP radiator [9] is connected with a heat pipe through a pipeline. The invention solves the problems of heat dissipation and temperature consistency when the transmitting and receiving chip assembly [4] is working, and heat preservation when not working, and achieves beneficial effects such as stable control, strong adaptability, and good temperature consistency.

Description

technical field [0001] The invention relates to satellite equipment, in particular to a thermal control device for a space-borne radar transmitting and receiving chip assembly with high-power pulse work on the space-borne. Background technique [0002] The on-board transmitting and receiving chip component is the key stand-alone unit of the radar subsystem of the radar satellite. Whether its working performance is normal or not directly affects the working performance of the radar satellite. The task of the thermal control design of the transmitting and receiving chip assembly is to ensure that the temperature of the transmitting and receiving chip assembly is within the specified range. Especially for high-power pulse-operated transmitting and receiving chip components, because the heat consumption of transmitting and receiving chip components is large when they work, and they work in pulse mode, the thermal control design of transmitting and receiving chip components is on...

AI Technical Summary

Problems solved by technology

[0008] In order to solve the problem that the existing thermal control device cannot meet the working temperature range, temperature difference requirements and temperature rise rate requirements of the space-borne transmitting and receiving chip assembly, the purpose of the present invention is to provide a thermal control device for the space-borne radar transmitting and receiving chip assembly. The invention solves the problems of heat dissipation, temperature consistency, and heat preservation when the spaceborne radar transmitting and receiving chip assembly is working, etc.

[0009] The thermal control device of the receiving chip assembly, using the present invention, solves the problems of heat dissipation, temperature consistency, and heat preservation when the spaceborne radar transmitting and receiving chip assembly is working, etc.

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