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An accelerated life prediction method for bga solder joints

A technology of accelerated life and prediction method, which is applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of unsuitable BGA solder joints, long test cycle, and inability to quickly obtain BGA solder joint life data, etc.

Active Publication Date: 2017-01-18
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the three commonly used accelerated life test methods at present, namely the constant stress accelerated life test method, the step stress accelerated life test method and the sequential stress accelerated life test method, cannot achieve the purpose of quickly obtaining the life data of BGA solder joints. The main reason is that Yes: The constant stress accelerated life test requires group tests, and the test period is long; the step stress and sequential stress accelerated test data are not suitable for the life estimation model of the best BGA solder joint—Engelmaier-Wild model

Method used

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  • An accelerated life prediction method for bga solder joints
  • An accelerated life prediction method for bga solder joints
  • An accelerated life prediction method for bga solder joints

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] a) Randomly select 32 BGA solder joint samples of speech devices (belonging to consumer electronics products), and carry out environmental stress screening treatment on the BGA solder joint samples, including performing the first temperature cycle treatment on the samples, and the first The temperature cycle treatment is to heat the sample to a temperature of 70°C and hold it for 10 minutes, then cool the sample temperature to -45°C at a speed of 15 (°C / min) and hold it for 10 minutes as a cycle cycle, and the sample is subjected to multiple cycles. Cycle processing until the sample fails, and record the processing time before the sample fails; (this part is the content of environmental stress screening)

[0095] b) Perform comprehensive stress treatment on the sample treated in step a), including: carry out the second temperature cycle treatment, random vibration treatment and electrical stress treatment on the sample treated in step a), and record the failure time of t...

Embodiment 2

[0120] a) Randomly select 40 BGA solder joint samples of the ground signal system circuit board (belonging to telecommunication equipment) for train operation, and carry out environmental stress screening treatment on the BGA solder joint samples, including performing the first temperature cycle treatment on the samples, so The first temperature cycle treatment is to heat the sample to a temperature of 85°C and hold it for 30 minutes, and then cool the sample temperature to -25°C at a speed of 25°C / min and hold it for 30 minutes as a cycle cycle. Sub-cycle processing until the sample fails, and records the processing time before the sample fails; the environmental stress screening part

[0121] b) Perform comprehensive stress treatment on the sample treated in step a), including: carry out the second temperature cycle treatment, random vibration treatment and electrical stress treatment on the sample treated in step a), and record the failure time of the sample; The second tem...

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Abstract

The invention relates to a BGA (ball grid array) welding point acceleration service life prediction method, which comprises the following steps that (a) n BGA welding point samples are randomly selected, wherein the n is greater than or equal to 5, and the BGA welding point samples are subjected to environment stress screening processing; (b) the samples processed in the step (a) are subjected to integral stress processing, and the integral stress processing comprises second temperature circulation processing, random vibration processing and electric stress processing on the samples processed in the step (a), and in addition, the sample failure time is recorded; (c) the samples processed in the step (b) are subjected to third temperature circulation processing; (d) a model shown in a formula (III) is used for calculating an acceleration factor, and finally, a formula (IV) is used for calculating the use average failure before time MTTR<use> for predicting the service life of the BGA welding point. The invention also provides application of the method to the preparation of electronic products and mechanical equipment.

Description

technical field [0001] The invention relates to packaging of electronic products, in particular to a BGA (Ball Grid Array, ball grid array) solder joint accelerated life prediction method. Background technique [0002] With the rapid development of electronic products in the direction of portable, miniaturized, networked and multimedia, higher requirements are put forward for the packaging technology of multi-chip components. New high-density packaging technologies continue to emerge. BGA (Ball Grid Array, ball grid Array) is a new high-density packaging process that has emerged in recent years. BGA changes the peripheral lead method used in traditional packaging, and changes the pins to be arrayed under the substrate, and changes the pins to Pb / Sn solder bumps. Compared with the traditional packaging form, BGA has the advantages of more I / O per unit area, small lead inductance and capacitance, good heat dissipation effect, and low alignment requirements, making it graduall...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/00G01N3/60
Inventor 王鹏廖岳汉王益民余锋周峰刘佳刘国涛张祥珊
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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