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Components with Josephson contacts and methods of making the same

A component and contact technology, applied in the direction of devices including a junction of different materials, manufacturing/processing of superconductor devices, chemical instruments and methods, etc., can solve problems that are not enough for large-scale manufacturing

Active Publication Date: 2017-02-22
FORSCHUNGSZENTRUM JULICH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The downside is that so far the reproducibility is only sufficient to demonstrate the feasibility of principle (proof of concept), however not sufficient for large-scale manufacturing due to the formation of very high number of rejects

Method used

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  • Components with Josephson contacts and methods of making the same
  • Components with Josephson contacts and methods of making the same
  • Components with Josephson contacts and methods of making the same

Examples

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Embodiment Construction

[0067] figure 1 An embodiment of an assembly according to the invention is shown. On a substrate 1.1 made of MgO with a surface cleaned by ion beam etching, there is a textured, approximately 10 nm thick, homoepitaxial MgO buffer layer 1.2. By cleaning the substrate, the amorphous layer is removed from its surface; this enables homoepitaxial growth. The textured areas are automatically predefined by the rough island-like structure of the buffer layer 1.2. On the homoepitaxial buffer layer 1.2 there is an approximately 0.5 nm thick layer of MgCO 3 The finished reverse epitaxial buffer layer 1.3. The reverse epitaxial buffer layer 1.3 decouples the orientation of the c-axis of the approximately 150 nm thick YBCO layer (functional layer) 1.4 applied thereon from the influence of the substrate 1.1. The c-axis is thus perpendicular to the surface of the YBCO layer 1.4 everywhere. At the same time, the a-axis and the b-axis were oriented at the rectangular island-like structure...

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Abstract

Electronic assemblies having Josephson contacts and methods of manufacture are suggested. The assembly comprises a substrate (1.1) and a layer of high-temperature superconducting material (1.4) arranged on the substrate, wherein the substrate has at least one stepped edge in its surface, wherein the layer At the step edges there are grain boundaries (1.5) which constitute one or more weak links of the Josephson contacts. According to the invention, on both sides of the step edge in the level of the high-temperature superconducting layer there is a texturing of the substrate and / or at least one buffer arranged between the substrate and the high-temperature superconducting layer The texture of the layer is used to orient the a-axis and / or the b-axis perpendicular to the grain boundaries with deviations of up to 10°. This can be achieved technically, for example, by growing the HTSL layer graphically and epitaxially. Due to the fact that the same crystal axes are each oriented perpendicular to the step edge towards both sides of the step edge, the maximum supercurrent can flow through the grain boundaries induced by the step edge and thus through the Josephson contact.

Description

technical field [0001] The present invention relates to electronic assemblies having Josephson contacts and methods of manufacture. Background technique [0002] High temperature superconductivity (high T c , HTSL) Josephson contacts between electrons are the fundamental unit of superconducting electronics. They are especially used in superconducting quantum interference devices (SQUIDs) for highly sensitive magnetic field measurements and in detectors for THz radiation. [0003] An important parameter of the Josephson contact is the critical current density J of the superconducting state c and the resistance R in the normally conducting state n . These quantities, especially their product J c* R n (and / or with the critical current I c The product of I c* R n ) as a figure of merit for the applicability of Josephson contacts for the purpose given by ( )A known. This document discloses that not only the J at the grain boundaries of the YBCO HTSL layer c and R ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L39/22C30B29/22H01L39/24H10N60/01H10N60/80H10N60/85
CPCH10N60/124H10N60/0632H10N60/0941H10N60/805H10N60/857
Inventor M.法利
Owner FORSCHUNGSZENTRUM JULICH GMBH
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