Method and device for monitoring pressure of test probe

Abstract

The invention belongs to the technical field of machining of a PCB (Printed Circuit Board), and relates to a method for monitoring pressure of a test probe. The method comprises the following steps: detecting an initial position of the test probe and acquiring a detection signal initial value corresponding to the initial position; feeding the test probe; detecting current displacement of the test probe, acquiring a detection signal dynamic value of the pressure corresponding to the current displacement, and controlling the test probe to stop feeding when the detection signal dynamic value is equal to a detection signal threshold value corresponding to preset pressure. The invention also relates to a device for monitoring the pressure of the test probe. The device comprises a probe sensor, a sensor work and analog voltage output circuit, an analog-digital conversion module, a data processing module and a control module. According to the method and the device, the pressure of the test probe is automatically monitored and accurately adjusted, the impact and the noise during feeding of the test probe are reduced, an obvious pricking trace at the PCB testing point is avoided, the recognition of a probe lifting position is realized, the waiting time of positioning movement is reduced, the testing efficiency is improved, and the testing misjudgment rate is reduced.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, and in particular relates to a method and a device for monitoring the pressure of test probes of PCB test equipment. Background technique [0002] Flying probe testing machine is an automatic test equipment for PCB light board, which uses a high-speed moving test probe mechanism to realize the electrical characteristic test of PCB network. In order to avoid the hard landing of the test probe on the PCB, the carrier of the test probe is designed as a plastic spring. In order to make the probe contact with the PCB measuring point well and the PCB board under test will not be deformed, it is necessary to contact the PCB when the test probe After that, continue to load the appropriate pre-tightening pressure through the movement of the lower needle, which is the test probe pressure. The test probe pressure control is the key technology of the flying probe tester. The superior test probe...

AI Technical Summary

Problems solved by technology

[0003] At present, the test probe pressure control method of the flying probe testing machine in the prior art is: by controlling the test probe to lower the needle until the probe detection sensor triggers, and it is also necessary to manually adjust the pressure of the probe when the sensor triggers, manually Adjustment needs to be felt by experience, and it is very inconvenient to use; in the test, it cannot automatically detect and respond to the pressure change of the probe due to test fatigue and damage, which brings inconvenience to test operation and maintenance

In addition, if the pressure of the test probe changes during the test, the probe may be misjudged due to poor contact, which will affect the test result and efficiency. More importantly, during the entire test probe lowering and lifting process Among them, the motion control system cannot realize the process control of the test probe, which makes it impossible to combine the resources of the motion control system to optimize the test needle-down and needle-lift actions, which affects the effect of test probe pressure optimization to a certain extent.

[0004] It can be seen that the monitoring method in the prior art cannot monitor automatically, and it is easy to generate test deviation during the monitoring process, which affects the test effect, and also cannot combine system resources to achieve efficient testing.

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