A dual-core GCT with a corrugated base and a transparent short-circuited anode and its preparation method
A transparent anode, GCT-B technology, applied in circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of difficult manufacturing process, difficult setting of grooves, and high requirements for GCT minority carrier lifetime control, to ensure commutation. Reliability, the effect of reducing the difficulty and cost of the manufacturing process
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[0032] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0033] figure 1 It is the cross-sectional structure diagram of the existing D-GCT. The main body adopts a common p-base region, and there is a trench isolation between GCT-A and GCT-B, which can be etched after forming a p-base region by large-area aluminum diffusion. accomplish. In order to ensure that the groove does not affect the J 2 To widen the depletion region of the junction and obtain a good isolation effect, the trench region should be as shallow and wide as possible, but if the trench region is too wide, it will not only cause gate-cathode J 3 The leakage current of the junction increases sharply, and the surface area of the silicon wafer occupied is also large, resulting in a decrease in the effective area of the cathode.
[0034] figure 2 For the D-GCT cross-sectional structure of the present invention, the entire device...
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