Small-size, high-sensitivity and high signal-to-noise ratio MEMS (Micro-electromechanical Systems) silicon microphone

A high-sensitivity, silicon microphone technology, applied in electrostatic transducer microphones, sensors, electrical components, etc., can solve the problem of increasing the cavity volume of microphone devices, meet the trend and demand of circuit integration, and reduce module volume , the effect of increasing sensitivity and signal-to-noise ratio

Active Publication Date: 2015-03-04
MG MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If you want to improve the sensitivity and signal-to-noise ratio of the device with the packaging method of back-feeding sound, you must increase the cavity volume of the microphone device itself. This approach is contradictory to the trend of device miniaturization.

Method used

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  • Small-size, high-sensitivity and high signal-to-noise ratio MEMS (Micro-electromechanical Systems) silicon microphone
  • Small-size, high-sensitivity and high signal-to-noise ratio MEMS (Micro-electromechanical Systems) silicon microphone
  • Small-size, high-sensitivity and high signal-to-noise ratio MEMS (Micro-electromechanical Systems) silicon microphone

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Embodiment Construction

[0027] According to attached figure 1 , the product of the present invention includes a metal shell cover 1, a sound inlet hole 2, an insulating glue 3, a MEMS device 4, an ASIC device 5, a metal solder ball 6, a cavity 7 on the MEMS device and a PCB board 8, and the PCB board is provided with The groove 9 , the first metal wire 10 , the second metal wire 11 , the third metal wire 12 , the fourth metal wire 13 , the fifth metal wire 14 and the closed ring 15 formed by conductive glue.

[0028] The vertical flip-chip forward sound packaging method of the MEMS silicon microphone of the present invention includes a metal case cover 1, a MEMS device 2 placed in the metal case cover, and a groove that matches the cavity 7 on the MEMS device 2 9 of the PCB board 8 (the PCB board 8 adopts a three-layer PCB board) and the ASIC device 5 placed in the groove 9 of the PCB board 8 .

[0029] According to attached Figure 2-7 , the metal case cover 1 of the present invention is provided ...

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Abstract

The invention provides a small-size, high-sensitivity and high signal-to-noise ratio MEMS (Micro-electromechanical Systems) silicon microphone. The MEMS silicon microphone comprises a metal housing cover, an MEMS device, an ASIC (Application Specific Integrated Circuit) device and a PCB. The MEMS silicon microphone is characterized in that a voice input hole is arranged in the metal housing cover; the MEMS device is adhered to the inner side of the metal housing cover through insulating glue; a cavity is formed in one surface of the MEMS device and abutted with the voice input hole; the PCB is a three-layer PCB; a groove is arranged in the PCB and opposite to the cavity by the position; the groove is positioned at the back of the cavity; the ASIC device is arranged at the central bottom part of the groove; a gap is formed between the top part of the ASIC device and the lower part of a vibration film of the MEMS device, so as to reach the packaging manner that the MEMS silicon microphone is vertically inversely mounted and voice is input from the front. The small-size, high-sensitivity and high signal-to-noise ratio MEMS silicon microphone is high in sensitivity and signal-to-noise ratio; the capacity of a module is reduced; the demand on high circuit integration is met.

Description

technical field [0001] The invention relates to a packaging method of a MEMS silicon microphone, in particular discloses a MEMS silicon microphone with small size, high sensitivity and high signal-to-noise ratio, belonging to the technical field of silicon microphone packaging. Background technique [0002] Microphones can convert human voice signals into corresponding electrical signals, and are widely used in mobile phones, computers, telephones, cameras and video cameras, etc. The traditional electret condenser microphone uses Teflon as the vibration film, which cannot withstand the high temperature of nearly 300 degrees in the reflow soldering process of the printed circuit board, so it can only be separated from the assembly of the integrated circuit and assembled by hand alone, which greatly increases the production cost . [0003] The development of MEMS (Microelectromechanical Systems) technology and process in the past three decades, especially the development of M...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor 缪建民倪梁
Owner MG MICROELECTRONICS CO LTD
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