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Submerged-arc welding high-moisture oxidation-resistant lead-free solder and preparation method thereof

A lead-free solder and submerged arc welding technology, which is applied in metal processing equipment, welding equipment, welding/cutting media/materials, etc., can solve the problems of solder stability, electromagnetic induction, etc., and achieve good wettability, The effect of good toughness and creep properties

Active Publication Date: 2015-04-01
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since Ni is a ferromagnetic substance, and its magnetic susceptibility at room temperature can reach 10 -3 Order of magnitude, for solder alloys, it is easy to generate electromagnetic induction, which will have a great impact on the stability of solder in use

Method used

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  • Submerged-arc welding high-moisture oxidation-resistant lead-free solder and preparation method thereof
  • Submerged-arc welding high-moisture oxidation-resistant lead-free solder and preparation method thereof
  • Submerged-arc welding high-moisture oxidation-resistant lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A high-wetting oxidation-resistant lead-free solder is composed of the following raw materials in weight percent:

[0041] Cu: 0.5%, Ni 3 V: 0.2%, nano ZrO 2 Particles: 0.6%, the balance being Sn.

[0042] According to the above weight percentage, Cu powder, Ni 3 V particles, nano ZrO 2 Particles, and Sn block, after mixing evenly, take a total mass of 2Kg, and place it in Al 2 o 3 crucible, and then sent it to a 500 ° C resistance furnace for melting. After it is completely melted, keep it warm for 150 minutes, fully stir it and take it out of the furnace, pour it into a welding rod mold, and obtain a lead-free solder bar after cooling.

Embodiment 2

[0044] A high-wetting oxidation-resistant lead-free solder is composed of the following raw materials in weight percent:

[0045] Cu: 0.7%, Ni 2 V: 0.3%, nano ZrO 2 Particles: 0.5%, the balance being Sn.

[0046] The preparation method of the lead-free solder strip in this example is the same as the preparation method of the lead-free solder strip in Example 1, the only difference is that the weight percentage of each component in the lead-free solder strip is weighed according to this example.

Embodiment 3

[0048] A high-wetting oxidation-resistant lead-free solder is composed of the following raw materials in weight percent:

[0049] Cu: 0.5%, NiV 3 : 0.1%, nano ZrO 2 Particles: 0.8%, the balance being Sn.

[0050]The preparation method of the lead-free solder strip in this example is the same as the preparation method of the lead-free solder strip in Example 1, the only difference is that the weight percentage of each component in the lead-free solder strip is weighed according to this example.

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Abstract

The invention relates to a welding material, in particular to a lead-free solder in the field of submerged-arc welding. The lead-free solder comprises, in weight percent, 0.2-0.8% of Cu, 0.075-0.5% of Ni-V alloy particles, 0.1-1.2% of nano ZrO2 particles and the balance Sn. The invention further relates to a preparation method which includes the steps: uniformly mixing components of the lead-free solder according to the mass ratio and then placing the components into an Al2O3 crucible; placing the crucible in a 400-600 DEG C resistance furnace for smelting; keeping the temperature for 100min to 200min after complete smelting; sufficiently stirring the components after keeping the temperature; discharging the components and pouring the components into a solder bar mould; cooling the components to obtain a lead-free solder bar. The lead-free solder has the advantages that wetting property is fine, electromagnetic induction is not generated, the lead-free solder has a fine creep performance and resistant to oxidation and the like.

Description

technical field [0001] The invention relates to a welding material, in particular to a lead-free solder used in the field of submerged arc welding. Background technique [0002] The traditional solder is Pb-Sn solder, which is widely used due to its good wettability, high reliability after soldering and low price. However, due to the toxicity of Pb element, the products made of Pb solder will cause great harm to the environment and human body, and do not meet the requirements of "green industry" and "sustainable development". Therefore, all countries in the world clearly prohibit the use of Pb solder, such as the WEEE directive and ROHS directive issued by the European Union in 2003. And my country also clearly stipulates that since March 2007, the use of Pb-containing solder has been banned. Therefore, the development of lead-free solder is imperative. [0003] The lead-free solders that are widely used at present include the following types: Sn-Cu, Sn-Ag, Sn-Zn, and Sn-...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40B23K35/362
CPCB23K35/262B23K35/362B23K35/40
Inventor 姚正军姚一波罗西希林玉划周艳军
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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