Ultrathin PI cover film and preparation method thereof

A cover film, ultra-thin technology, applied in chemical instruments and methods, film/sheet adhesives, printed circuit manufacturing, etc., can solve the problems of high cost, high difficulty, low yield, etc., to improve operation Improve performance and production efficiency, improve static bending resistance, and meet performance requirements

Inactive Publication Date: 2015-04-01
GUANGDONG SHENGYI SCI TECH
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For PI film production plants, it is very difficult to manufacture 3 μm and 5 μm PI films, and the yield is low, so the cost remains high, and it is also extremely dif

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrathin PI cover film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0020] Example 1

[0021] A preparation method of ultra-thin PI cover film, including the following steps:

[0022] (1) Configure the above polyimide acid prepolymer (PAA) solution, and coat a layer of the above polyimide acid prepolymer (PAA) solution on the 18μm oil-free aluminum foil of Chinalco to control the coating The drying thickness is 3μm, and it is dried in a continuous oven at 120℃-150℃-160℃, and then imidized in a continuous high temperature oven at 180-360℃ to form an ultra-thin PI film;

[0023] (2) Coat one side of the ultra-thin PI film with special glue SF305C for covering film from Guangdong Shengyi Technology Co., Ltd., and control the drying thickness of the coating to 10μm. -75W release paper compound, get ultra-thin PI covering film.

[0024] Use this ultra-thin PI cover film and etched copper clad laminate to fast press, fast press conditions 100MPa, 180°C, 120 seconds, then cure at 170°C for 1 hour, but soak it in 10% dilute hydrochloric acid for 5 minutes to...

Example Embodiment

[0025] Example 2

[0026] A preparation method of ultra-thin PI cover film, including the following steps:

[0027] (1) Prepare the above polyimide acid prepolymer (PAA) solution, and coat a layer of the above polyimide acid prepolymer (PAA) solution on the 25μm oil-free aluminum foil of Chinalco to control the coating The drying thickness is 5μm, and it is dried in a continuous oven at 120℃-150℃-160℃, and then imidized in a continuous high temperature oven at 180-360℃ to form an ultra-thin PI film;

[0028] (2) Coat one side of the ultra-thin PI film with special glue SF305C for covering film from Guangdong Shengyi Technology Co., Ltd. to control the drying thickness of the coating to 15μm. After drying, it will be combined with release paper. , Get ultra-thin PI cover film.

[0029] Use this ultra-thin PI cover film and etched copper clad laminate to fast press, fast press conditions 100MPa, 180°C, 120 seconds, then cure at 170°C for 1 hour, but soak it in 10% dilute hydrochloric a...

Example Embodiment

[0030] Example 3

[0031] A preparation method of ultra-thin PI cover film, including the following steps:

[0032] (1) Prepare the above polyimide acid prepolymer (PAA) solution, and coat a layer of the above polyimide acid prepolymer (PAA) solution on the 35μm oil-free aluminum foil of Chinalco to control the coating The drying thickness is 8μm, and it is dried in a continuous oven at 120℃-150℃-160℃, and then imidized in a continuous high temperature oven at 180-360℃ to form an ultra-thin PI film;

[0033] (2) Coat one side of the ultra-thin PI film with special glue SF305C for covering film from Guangdong Shengyi Technology Co., Ltd. to control the drying thickness of the coating to 15μm. After drying, it will be combined with release paper. , Get ultra-thin PI cover film.

[0034] Use this ultra-thin PI cover film and etched copper clad laminate to fast press, fast press conditions 100MPa, 180°C, 120 seconds, and then cure at 170°C for 1 hour, but soak in 10% dilute hydrochloric ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an ultrathin PI cover film and a preparation method thereof. The ultrathin PI cover film comprises a PI film, release paper arranged at one side of the PI film and an adhesive layer arranged between the PI film and the release paper, wherein the thickness of the PI film is 3-9mu m, and the other side of the PI film is also provided with metal foil. By using the ultrathin PI cover film and the preparation method thereof, the static flexural endurance of a circuit board is improved, the difficulty for producing the circuit board by using the ultrathin PI cover film is lowered, the operability and the production efficiency are improved, and all performance requirements of a flexible plate are met.

Description

technical field [0001] The invention relates to the technical field of cover films, in particular to an ultra-thin PI cover film and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of smart phones, light and thin, portable and low cost have become the main trend of mobile electronic products. The flexible circuit boards used in electronic products are becoming thinner and thinner, which requires not only thinner copper foil and PI films for substrates, but also thinner PI films for cover films. The industry widely uses 12μm PI film coated with modified epoxy resin or acrylic resin to obtain a general-purpose cover film. Nowadays, the thickness of PI film is required to be further reduced. The industry has mass-produced and developed PI films of 10 μm and 8 μm. However, for thicknesses of 5 μm and below, it is almost impossible for general manufacturers to mass-produce. For PI film production plants, it is very difficu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J7/02B32B15/08B32B27/28C08G73/10H05K3/00
Inventor 伍宏奎梁立戴周
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap