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Ultrathin PI cover film and preparation method thereof

A cover film, ultra-thin technology, applied in chemical instruments and methods, film/sheet adhesives, printed circuit manufacturing, etc., can solve the problems of high cost, high difficulty, low yield, etc., to improve operation Improve performance and production efficiency, improve static bending resistance, and meet performance requirements

Inactive Publication Date: 2015-04-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For PI film production plants, it is very difficult to manufacture 3 μm and 5 μm PI films, and the yield is low, so the cost remains high, and it is also extremely difficult to produce cover films and circuit boards with 3 μm and 5 μm PI films, which is not conducive to use , affecting the further thinning of flexible circuit boards

Method used

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  • Ultrathin PI cover film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of preparation method of ultra-thin PI covering film, comprises the steps:

[0022] (1) Configure the above-mentioned polyimide acid prepolymer (PAA) solution, coat the above-mentioned polyimide acid prepolymer (PAA) solution of one deck on the 18 μm oil-free aluminum foil of Chinalco, control coating The drying thickness is 3 μm, after drying in a continuous oven at 120°C-150°C-160°C, and then imidizing in a continuous high-temperature oven at 180-360°C, an ultra-thin PI film is formed;

[0023] (2) The ultra-thin PI film will be corona coated on one side of the special glue SF305C of Guangdong Shengyi Technology Co., Ltd. for the cover film, and the drying thickness of the coating is controlled to be 10 μm. - 75W release paper lamination, get ultra-thin PI cover film.

[0024] Use the ultra-thin PI cover film and the etched copper-clad laminate for rapid pressing, the rapid pressing conditions are 100MPa, 180°C, 120 seconds, and then cured at 170°C for 1 hour,...

Embodiment 2

[0026] A kind of preparation method of ultra-thin PI covering film, comprises the steps:

[0027] (1) configure the above-mentioned polyimide acid prepolymer (PAA) solution, coat the above-mentioned polyimide acid prepolymer (PAA) solution of one deck on the 25 μm oil-free aluminum foil of Chinalco, control coating The drying thickness is 5 μm, after being dried in a continuous oven at 120°C-150°C-160°C, and then imidized in a continuous high-temperature oven at 180-360°C, an ultra-thin PI film is formed;

[0028] (2) Corona the ultra-thin PI film, and coat the special glue SF305C for the cover film of Guangdong Shengyi Technology Co., Ltd. on one side, control the dry thickness of the coating to 15 μm, and compound it with the release paper after drying , to obtain ultra-thin PI cover film.

[0029] Use the ultra-thin PI cover film and the etched copper-clad laminate for rapid pressing, the rapid pressing conditions are 100MPa, 180°C, 120 seconds, and then cured at 170°C for...

Embodiment 3

[0031] A kind of preparation method of ultra-thin PI covering film, comprises the steps:

[0032] (1) configure the above-mentioned polyimide acid prepolymer (PAA) solution, coat the above-mentioned polyimide acid prepolymer (PAA) solution of one deck on the 35 μm oil-free aluminum foil of Chinalco, control coating The drying thickness is 8 μm, after drying in a continuous oven at 120°C-150°C-160°C, and then imidizing in a continuous high-temperature oven at 180-360°C, an ultra-thin PI film is formed;

[0033] (2) Corona the ultra-thin PI film, and coat the special glue SF305C for the cover film of Guangdong Shengyi Technology Co., Ltd. on one side, control the dry thickness of the coating to 15 μm, and compound it with the release paper after drying , to obtain ultra-thin PI cover film.

[0034] Use the ultra-thin PI cover film and etched copper-clad board for quick pressing, the quick pressing conditions are 100MPa, 180°C, 120 seconds, and then cured at 170°C for 1 hour, th...

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Abstract

The invention provides an ultrathin PI cover film and a preparation method thereof. The ultrathin PI cover film comprises a PI film, release paper arranged at one side of the PI film and an adhesive layer arranged between the PI film and the release paper, wherein the thickness of the PI film is 3-9mu m, and the other side of the PI film is also provided with metal foil. By using the ultrathin PI cover film and the preparation method thereof, the static flexural endurance of a circuit board is improved, the difficulty for producing the circuit board by using the ultrathin PI cover film is lowered, the operability and the production efficiency are improved, and all performance requirements of a flexible plate are met.

Description

technical field [0001] The invention relates to the technical field of cover films, in particular to an ultra-thin PI cover film and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of smart phones, light and thin, portable and low cost have become the main trend of mobile electronic products. The flexible circuit boards used in electronic products are becoming thinner and thinner, which requires not only thinner copper foil and PI films for substrates, but also thinner PI films for cover films. The industry widely uses 12μm PI film coated with modified epoxy resin or acrylic resin to obtain a general-purpose cover film. Nowadays, the thickness of PI film is required to be further reduced. The industry has mass-produced and developed PI films of 10 μm and 8 μm. However, for thicknesses of 5 μm and below, it is almost impossible for general manufacturers to mass-produce. For PI film production plants, it is very difficu...

Claims

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Application Information

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IPC IPC(8): C09J7/02B32B15/08B32B27/28C08G73/10H05K3/00
Inventor 伍宏奎梁立戴周
Owner GUANGDONG SHENGYI SCI TECH
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