Test structure of micro-beam fracture strength based on lateral comb tooth type capacitance

Abstract

The invention discloses a test structure of micro-beam fracture strength based on lateral comb tooth type capacitance. The test structure comprises a substrate, a door-shaped hot execution structure, a lateral comb tooth capacitance detection structure and a to-be-tested micro-beam structure, wherein the entire test structure is completely symmetrical with respect to a longitudinal central axis L; two longitudinal beams (202) of the door-shaped hot execution structure are respectively vertically connected with two tail ends of a wide cross beam (201), and the other end of each longitudinal beam (202) is fixed on the side surface of a lower anchor area (203); a to-be-tested micro beam (301) is parallel to the two longitudinal beams (202) of the door-shaped hot execution structure and is positioned in right middle of the two longitudinal beams (202), one end of the to-be-tested micro beam (301) is vertically connected to the middle part of the inner side of the wide cross beam (201), and the other end of the to-be-tested micro beam (301) is connected to one side surface of an upper anchor area (302); and the lateral comb tooth capacitance detection structure is sequentially arrayed at the rear part of the to-be-detected micro-beam anchor area (302) by virtue of three groups of completely same comb tooth structures positioned in the door-shaped structure. The invention also discloses a specific working mode for detecting tensile elongation by using lateral comb tooth differential capacitance and further determining tensile force. The test structure disclosed by the invention is high in sensitivity, and is convenient and feasible.

Description

technical field [0001] The invention relates to the field of testing the breaking strength of a micro-electromechanical system (MEMS), in particular to a testing structure for detecting the breaking strength of a micro-beam with a transverse comb-tooth capacitance. Background technique [0002] MEMS uses the combination of microelectronics technology and micromachining technology to manufacture microsensors, microactuators, microdrivers and microsystems. The mechanical properties of MEMS microstructures processed by different processing technologies, such as silicon micromachining, silicon surface micromachining, LIGA technology, bonding technology, etc., will have very different mechanical properties. Products also vary. Therefore, for the reliability of MEMES design, processing and application, it is very important to design the test structure and extract the relevant mechanical parameters. Tensile breaking strength is one of the important mechanical properties. The comm...

AI Technical Summary

Problems solved by technology

The mechanical properties of MEMS microstructures processed by different processing technologies, such as silicon micromachining, silicon surface micromachining, LIGA technology, bonding technology, etc., will have very different mechanical properties. Products will also vary

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