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Multi-wavelength lamination imaging technology facing to three-dimensional information recovery

A three-dimensional imaging, multi-wavelength technology, applied in the field of three-dimensional imaging, can solve problems such as layer-to-layer interference

Inactive Publication Date: 2015-04-01
UNIVERSITY OF CHINESE ACADEMY OF SCIENCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, solve the problem of mutual interference between layers in the traditional stacked imaging process of thick objects, and enable three-dimensional imaging of thick objects

Method used

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  • Multi-wavelength lamination imaging technology facing to three-dimensional information recovery
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  • Multi-wavelength lamination imaging technology facing to three-dimensional information recovery

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Embodiment Construction

[0075] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0076] Figure 1a and Figure 1b They are respectively the optical path structure diagrams of two typical implementations of the imaging method of the present invention in transmission and reflection multi-wavelength lamination imaging. The structure includes a red laser 1, a green laser 2, a blue laser 3, a beam splitter 4, a collimator beam expander system 5, a two-dimensional translation platform and a sample to be tested 6, an image sensor CCD7, a computer 8, and a mirror 9. The distance from the translation platform 6 to the image sensor 7 is d. The translation platform 6 and the image sensor 7 are respectively controlled by a computer 8 to complete phase shift addition, stack scanning and image recording. First turn on the red laser 1, turn off the green laser 2 and blue laser 3 for experiments, and record a set of intensity images under red lig...

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Abstract

The invention discloses a multi-wavelength lamination imaging technology facing to three-dimensional information recovery. Samples to be tested are irradiated by various wavelengths and are translated successively in a lamination scanning way in a measurement plane, and corresponding series intensity images are recorded by an image sensor, the recorded series intensity images are processed, and a three-dimensional image of each sample to be tested can be obtained in a computer by an iterative reconstruction algorithm based on multi-wavelength lamination scanning. According to the selection of diffraction distance in a multi-wavelength lamination algorithm, the information of the surface layer, the bottom layer and each inner layer of each sample to be tested can be respectively recovered, i.e. the three-dimensional complex amplitude information of the sample to be tested can be recovered, and the problem that layers in the traditional lamination imaging are mutually overlapped and are difficult to distinguish can be effectively solved. According to the multi-wavelength lamination imaging technology, various wavelengths are adopted, so that the quality of the recovered image can be greatly improved, and meanwhile, the anti-noise capability of the system is better. The multi-wavelength lamination imaging technology has the advantages of high imaging efficiency and good transportability and is suitable for the three-dimensional imaging of the surface layer of a reflection-type object, the imaging of the surface layer and the bottom layer of a transmission-type thin object and the three-dimensional imaging of each layer of a transmission-type thick object.

Description

technical field [0001] The invention relates to a three-dimensional imaging technology, in particular to a method of recovering the three-dimensional complex amplitude image information of the surface layer and the interior of a thicker sample to be measured by multi-wavelength illumination and lamination scanning. Background technique [0002] Laminated imaging technology is a lensless scanning coherent diffraction imaging technology. By controlling the illumination beam or object, different positions on the object are illuminated, and then a series of diffraction patterns obtained are used to restore the object image. See (Ultramicroscopy 10(3):187-198, 1987). The stack iterative algorithm is essentially a phase recovery algorithm, but it is different from the traditional phase recovery algorithm. It restricts the phase recovery of the diffraction distribution at each position to eliminate the ambiguity of understanding, so it is relatively Compared with the traditional p...

Claims

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Application Information

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IPC IPC(8): G06T15/00G06T5/00
CPCG06T5/00G06T15/00
Inventor 史祎诗张骏李拓王雅丽高乾坤
Owner UNIVERSITY OF CHINESE ACADEMY OF SCIENCES
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