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Surface sensor chip packaging structure and manufacturing method

A sensor chip and package structure technology, which is applied in the field of surface sensor chip package structure and production, can solve the problems of large surface sensor chip package thickness, lower product reliability, and non-replacement, etc., to meet the needs of miniaturization development, The effect of reducing the package size and reducing the overall cost

Active Publication Date: 2018-05-01
HUATIAN TECH KUNSHAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this form of surface sensing chip packaging structure, the bonding wire between the surface sensing chip and the substrate is easily crushed and broken, and no other dielectric layer can be placed on the bonding wire, which affects the packaging yield of the product and reduces the product reliability
Due to the limitation of the wire bonding process, the package thickness of the surface sensor chip completed by this process is relatively thick, which cannot meet the requirement of minimizing the package volume.

Method used

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  • Surface sensor chip packaging structure and manufacturing method
  • Surface sensor chip packaging structure and manufacturing method
  • Surface sensor chip packaging structure and manufacturing method

Examples

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Effect test

Embodiment 1

[0053] Such as Figure 11As shown, a surface sensing chip packaging structure includes a surface sensing chip having a first surface 101 and a second surface 102 opposite to each other, the first surface 101 has a sensing area 103 and a sensor located around the sensing area 103 Several welding pads 104 are electrically connected to the sensing area 103; the first plastic sealing layer 2 exposing the sensing area 103 is formed on the first surface 101, and the exposed sensing area 103 is formed on the first surface 101; A protective cover 6 is provided on the area 103; a first opening 3 is formed on the second surface 102 at a position opposite to each of the welding pads 104, and on the inner wall of the second surface 102 and the first opening 3 An insulating layer 4 exposing the welding pad 104 is formed, and a metal wiring layer 5 electrically connected to the exposed part of the welding pad 104 is formed on the insulating layer 4; a protective layer is formed outside the ...

Embodiment 2

[0068] This embodiment 2 includes all the technical features in embodiment 1, such as Figure 12 As shown, the difference is that there is another functional chip 9, the functional chip 9 is electrically connected to the metal wiring layer 5 on the second surface 102, and the functional chip 9 is fixed on the insulating layer on the second surface 102. layer 4 and the second plastic encapsulation layer 7 , and the functional chip 9 is electrically connected to the metal wiring layer 5 on the second surface 102 by wire bonding.

[0069] The manufacturing method of the package structure of the surface sensing chip of the present embodiment 2 comprises the following steps:

[0070] a. see figure 1 , prepare a wafer with several surface sensing chip units, each of the surface sensing chip units has a first surface 101 and a second surface 102 opposite to the first surface 101; the surface sensing chip unit The first surface 101 has a sensing area 103 and several welding pads 104...

Embodiment 3

[0081] This embodiment 3 includes all the technical features in embodiment 1, such as Figure 13 As shown, the difference is that 1. There is another functional chip 9, the functional chip 9 is electrically connected to the metal wiring layer 5 on the second surface 102, and the functional chip 9 is connected to the The metal wiring layer 5 on the second surface 102 is electrically connected. 2. The protective cover 6 covering the sensing area 103 formed on the first surface 101 is replaced by a layer of first plastic sealing layer 2, the first plastic sealing layer 2 covers the sensing area 103, and the first plastic sealing layer covering the sensing area 103 Layer 2 has a predetermined thickness, and the material of the first plastic encapsulation layer may have a relatively large Mohs hardness.

[0082] The manufacturing method of the package structure of the surface sensing chip of the present embodiment 3 comprises the following steps:

[0083] a. see figure 1 , prepa...

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Abstract

The invention discloses a packaging structure for a surface-sensing chip and a fabrication method. The packaging structure comprises the surface-sensing chip and a functional chip, a first surface of the surface-sensing chip is provided with a plurality of pads and sensing areas, first openings corresponding to the pads are formed in a second surface of the surface-sensing chip, insulating layers and metal wiring layers are laid in the first openings, the metal wiring layers lead the electrical property of the pads on the first surface onto the second surface, and a plastic package layer is arranged on the periphery of the surface-sensing chip; the second surface of the surface-sensing chip can be added with the functional chip, and the functional chip is electrically connected with the metal wiring layer on the second surface. The invention adopts the through silicon via (TSV) technology to lead the electrical property of the pads of the first surface of the chip onto the second surface of the chip, thus packaging size is reduced; moreover, the wafer level packaging (WLP) technology is utilized for overall packaging first, the wafer is then cut into a single chip, and thereby overall cost is reduced; since the periphery of the chip is packaged with plastic, the reliability of the chip is enhanced.

Description

technical field [0001] The invention relates to a surface sensing chip packaging structure and technology, in particular to a surface sensing chip packaging structure and a manufacturing method. Background technique [0002] Surface sensing chips or surface sensing chips, such as fingerprint recognition surface sensing chips, touch-type surface sensing chips, etc., have been continuously expanded due to their simplicity and practicability. Smart terminal devices with increasingly powerful functions are also beginning to carry more and more surface sensing chips. However, current devices have higher requirements for short, light and thin packaging devices, and the packaging volume of such surface sensing chips equipped with them must also be will seek to minimize. [0003] However, the traditional surface sensing chip usually uses a wire bonding process to connect the surface sensing chip to the substrate. The specific structure is: the surface sensing chip has a first surfa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00B81C1/00
Inventor 万里兮黄小花王晔晔沈建树翟玲玲钱静娴金凯
Owner HUATIAN TECH KUNSHAN ELECTRONICS
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