Check patentability & draft patents in minutes with Patsnap Eureka AI!

External modulation type few-mode optical communication transmitter chip based on multi-mode interferometer structure

A multi-mode interference and external modulation technology, applied in the directions of light guides, optics, instruments, etc., can solve the problems of complex system composition and practical difficulties, and achieve the goal of improving communication capacity, reducing electrical interconnection distance, and reducing device volume. Effect

Active Publication Date: 2018-09-11
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this system, there are problems in the stability of each device, the insertion loss between devices, and the integrability of devices, etc., and its complex system composition makes it difficult to realize practical application.
In an actual communication system, each device must have higher stability, better integration, and less loss in order to make the system more stable and practical

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • External modulation type few-mode optical communication transmitter chip based on multi-mode interferometer structure
  • External modulation type few-mode optical communication transmitter chip based on multi-mode interferometer structure
  • External modulation type few-mode optical communication transmitter chip based on multi-mode interferometer structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0024] figure 1 It is a structural schematic diagram of the externally modulated few-mode optical communication transmitting chip based on the multi-mode interferometer structure of the present invention, as shown in figure 1 As shown, the externally modulated few-mode optical communication transmitting chip based on the multimode interferometer structure includes a single longitudinal mode laser unit 1, a multimode interferometer (MMI) mode multiplexer combination unit 2, a modulator array 3 and an optical waveguide Unit 4, where:

[0025] The integration between the multimode interferometer (MMI) mode multiplexer combination unit 2 and the single longitudinal mode laser unit 1, and the modulator array 3 can be selected...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an outer modulation type less-mode optical communication emitting chip based on a multi-mode interference device structure, and relates to the field of less-mode optical communication. The chip comprises a single-longitudinal-mode laser unit, a multi-mode interference device mode multiplexer combination unit, a modulator array and an optical waveguide unit, wherein the single-longitudinal-mode laser unit is used for generating a base-mode optical signal, the multi-mode interference device mode multiplexer combination unit is used for converting a base mode optical signal generated by the single-longitudinal-mode laser unit into a base-mode signal and a high-order-mode signal, the optical waveguide unit is used for transmitting the base-mode signal and the high-order-mode signal to the modulator array, the modular array comprises a plurality of modulators respectively used for modulating the received base-mode signals and high-order-mode signals. The outer modulation type less-mode optical communication emitting chip has the advantages that the structure is compact, and the size of a device is reduced. Compared with a split device, the outer modulation type less-mode optical communication emitting chip has the characteristics that the electric mutual connecting distance is reduced, the stability is good, and the foundation is laid for further increasing the communication volume.

Description

technical field [0001] The invention relates to the technical field of optical few-mode optical communication, in particular to an externally modulated few-mode optical communication transmitting chip based on a multi-mode interferometer structure. Background technique [0002] In order to meet the ever-increasing demand for communication capacity and bandwidth, single-mode fiber is currently used as the main carrier medium, and dense wavelength division multiplexing (WDM), optical time division multiplexing (OTDM), polarization multiplexing (PDM) and new high-order The optical fiber communication system with modulation format can already support the transmission capacity of about 100 THz, approaching the transmission bandwidth limit of single-mode optical fiber. [0003] In order to further increase the capacity of the communication system, the mode-division multiplexing technology emerges as the times require. The mode-division multiplexing technology is a technology that ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/125G02B6/293
CPCG02B6/29344
Inventor 张莉萌陆丹赵玲娟余力强潘碧玮王圩
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More