A silicon piezoresistive temperature compensation evaluation method

Abstract

The invention belongs to silicon piezoresistive temperature compensation technology, and relates to a temperature compensation evaluation method based on the silicon piezoresistive principle. In the present invention, the resistance values ​​of the four force-sensitive resistors constituting the Huishiden bridge of the silicon piezoresistive chip under multiple temperatures and pressures are input, and different compensation circuit structures, compensation devices and compensation device parameters are used as variables. By establishing a mathematical model , analyze and automatically calculate different compensation circuit structures, obtain compensation results related to variables, use theoretical compensation results at multiple temperature points and pressure points to roughly estimate whether the selection of intermediate compensation variables is appropriate and the selection range. The present invention establishes a mathematical model that can automatically and batch process data on the basis of theoretical analysis, and uses the mathematical model to quickly and accurately obtain an evaluation conclusion about a specific temperature compensation algorithm before the product is realized, which has great practical application value.

Description

Technical field [0001] The invention belongs to silicon piezoresistance temperature compensation technology, and relates to a temperature compensation evaluation method based on the principle of silicon piezoresistance. Background technique [0002] Since the material used in the silicon piezoresistive sensor is semiconductor silicon, it is greatly affected by temperature. When the ambient temperature changes drastically, the temperature is the biggest obstacle to the accuracy of pressure measurement. In order to improve the pressure measurement accuracy of the sensor, in addition to maintaining the consistency of the process when making the silicon piezoresistive chip, a temperature compensation is also required to eliminate the difference in chip performance. [0003] Because the sensor is used in different situations, its requirements are also very different. When the actual temperature compensation is performed, the change of a certain parameter will have an unpredictable impac...

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Problems solved by technology

[0003] Since the sensor is used in different occasions, its requirements are also very different. In the actual temperature compensation, the change of a certain parameter will have an inestimable impact on the compensation result, so it is difficult to quickly and accurately determine the compensation parameters.

[0004] In general, the temperature compensation of the existing silicon piezoresistor needs to assemble the corresponding circuit for test verification and analysis, which will waste a lot of manpower, material resources, financial resources and time investment

At the same time, this method can only be limited to small-scale research and trial production, and cannot realize automatic and mass production

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