High-performance nano carbon cooling composite material

Abstract

The invention discloses a high-performance nano carbon cooling composite material, which is composed of two parts, namely a carrier and a coating, wherein the carrier is a copper tape or an aluminum tape; the coating is prepared from the following raw materials in parts by weight: 20-55 parts of organic resin, 20-60 parts of nano carbon, 1-5 parts of propyl trimethoxysilane or propyl trimethylsilane, 1-10 parts of gamma-methacryloxypropyltrimethoxysilane and 0.5-3 parts of polyethylene glycol. The nano carbon and the organic resin are compounded and coated on the copper tape or the aluminum tape, so that the fitting property of the coating material and a base material is improved; the heat dissipation performance can also be improved; the machinability, the flexibility and the heat dissipation performance of the product can be improved by the copper tape or the aluminum tape as the carrier of the nano carbon or the resin; and the compatibility with the resin material can be improved by nano carbon pretreatment by the gamma-methacryloxypropyltrimethoxysilane, so that the overall mechanical property of the composite material is improved.

Description

technical field [0001] The invention relates to a heat dissipation material, in particular to a high-performance nano-carbon heat dissipation composite material, which belongs to the technical field of polymer materials. Background technique [0002] Composite materials (Composite materials) are materials with new properties composed of two or more materials with different properties through physical or chemical methods on a macroscopic (microscopic) level. Various materials learn from each other in terms of performance and produce synergistic effects, so that the comprehensive performance of the composite material is better than that of the original constituent materials to meet various requirements. [0003] There are three ways of heat conduction: heat conduction, heat convection, and heat radiation. At present, heat conduction materials on the market all adopt the mode of heat transfer. With the development of electronic technology, electronic products are developing tow...

AI Technical Summary

Problems solved by technology

[0005] In the preparation or application of some electronic components that require both electrical conduction and strict heat dissipation requirements, there are strict heat dissipation requirements for their preparation materials or connector materials, and the existing heat conduction materials alone cannot meet the requirements of electrical conductivity during application. Requirements, the thermal conductivity or heat dissipation of conductive materials used alone is poor, therefore, a composite material that can meet the requirements of heat dissipation and conductivity at the same time is needed to meet the needs of the market

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