Laser perforation system and laser perforation method
A laser and laser technology, applied in earth-moving drilling, fluid production, wellbore/well components, etc., can solve problems such as perforation depth limitation and laser energy density reduction, and achieve the effect of increasing depth
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Embodiment 1
[0062] like figure 1 As shown, the laser perforation system provided in this embodiment includes:
[0063] laser 1;
[0064] a sensor 4 for detecting the position of the bottom of the formed perforation; and
[0065] The controller 3 is configured to control the operation of the laser 1, and move the laser 1 along the optical path based on the measurement results of the sensor 4, so that the focus of the laser light emitted by the laser 1 is at the bottom of the formed perforation hole.
[0066] When in use, the laser 1 emits light for the first time and forms a perforation hole on the surface of the object to be perforated; then the laser 1 is turned off, and the sensor 4 measures the position of the bottom of the formed perforation hole, and then uses the controller 3 to control the adjustment The laser 1 moves so that the focus of the laser light of the laser 1 is at the bottom of the formed perforation hole, and finally the laser 1 emits light for the second time to cont...
Embodiment 2
[0086] like Figure 5 As shown, this embodiment provides a laser perforation method, including:
[0087] Step 20, make the laser emit light for the first time, and form a perforation on the surface of the object to be perforated;
[0088] Step 30, adjusting the distance between the emitting end of the laser and the bottom of the perforation hole, so that the focus of the laser light emitted by the laser is at the bottom of the perforation hole;
[0089] Step 40, make the laser emit light for the second time, and continue processing the perforation hole on the basis of the perforation hole.
[0090] In the laser perforation method provided in this embodiment, after the laser emits light for the first time, the distance between the laser and the bottom of the formed perforation hole is adjusted so that the focus of the laser moves to the bottom of the perforation hole, and then the laser is used to The second perforation is carried out to realize the deepening of the perforati...
Embodiment 3
[0093] like Figure 6 As shown, the laser perforation method provided in this embodiment includes:
[0094] Step 10, adjusting the position of the laser so that the emitting end of the laser forms a preset distance from the surface of the object to be perforated;
[0095] Step 20, make the laser emit light for the first time, and form perforation holes on the surface of the object to be perforated;
[0096] Step 31, using a sensor to measure the position of the bottom of the perforation hole;
[0097] Step 32, moving the laser according to the measured position of the bottom of the perforation hole, thereby adjusting the distance between the emitting end of the laser and the bottom of the perforation hole;
[0098] Step 40, make the laser emit light for the second time, and continue processing the perforation hole on the basis of the perforation hole.
[0099] In this embodiment, step 20 is the same as or similar to step 20 in the first embodiment, and will not be repeated ...
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