Visual automatic air-hopping wafer picker and its operation method

Abstract

The invention relates to a visualized automatic blank-jumping wafer picking machine. The visualized automatic blank-jumping wafer picking machine comprises a feeding testing system, a bonding system and a wafer testing system, wherein the feeding testing system comprises a Tray PR projection mechanism, a first photometry auxiliary lamp and a Tray workbench; the bonding system comprises a mechanical arm, a solenoid valve vacuum blowing and suction pipe and a swing arm motor; the wafer testing system comprises an ion gun, a water PR projection mechanism, a second photometry auxiliary lamp, a wafer, a wafer workbench, an inner-ring fixing ring, a center assembly, an XY lead screw and a motor. The visualized automatic blank-jumping wafer picking machine can achieve automatic blank-jumping when a wafer chip lacks, the functions of equipment of a manufacturer are changed, new functions are created, and the wafer picking machine achieves automation and is more convenient to use and high in efficiency. The wafer picking machine saves the time wasted due to lack, blank lines and line breaking of wafers, manual clamping through tweezers is not needed, the equipment does not need to be shut down to complete actions which the equipment can not complete, and the cumbersome trouble of point elimination and point supplement is avoided.

Description

technical field [0001] The present invention relates to the field of automation equipment, and more specifically, relates to a visual automatic air-jump wafer picker in which a manual mode is changed to an automatic idle-jump mode. At the same time, the present invention also relates to an operation method of the picker. Background technique [0002] When the existing visual wafer picking machine is picking grains, the wafers enter the customer's production line after OEM processing, which will change with the process of the process, resulting in blank lines and missing wafers, while the existing equipment It only recognizes complete wafer chips, and does not have the function of skipping incomplete wafer chips, so it will be subject to many limitations when picking grains. When a chip is missing during the picking process, the general method is to use tweezers to manually pick up the chip from the chip to the missing place, and forcibly fill in the coordinate position of th...

AI Technical Summary

Problems solved by technology

When a chip is missing during the picking process, the general method is to use tweezers to manually pick up the chip from the chip to the missing place, and forcibly fill in the coordinate position of the chip; for the missing part of the chip with more missing parts, it is necessary to perform software elimination points to complete. , extremely cumbersome

These methods are difficult to guarantee continuity, very inconvenient, and the efficiency is directly affected

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