Photoresist-removing water-based stripping liquid composition

Abstract

The invention relates to a photoresist stripping liquid composition which is mainly used for removing unexposed photoresist in the manufacturing process of a semiconductor device. The photoresist stripping liquid comprises the following components in percentage by mass: 20-70% of a polar solvent, 5-50% of an organic amine compound, 0.01-5% of a surfactant, 0.01-5% of a corrosion inhibitor and 10-60% of deionized water. In the process, the unexposed photoresist in the semiconductor device is removed at a low temperature, corrosion to metal of the semiconductor device is minimized, and a PI bottom film is not swelled.

Description

technical field [0001] The invention relates to a water-based stripping solution composition for photoresist in a semiconductor manufacturing process. The stripping solution can effectively remove unexposed photoresist, and does not corrode the substrate of a semiconductor device, and has no effect on the PI bottom film. No swelling occurs. Background technique: [0002] Many photoresist strippers have been used as in-line cleaners during the fabrication of large scale integrated circuits. In the manufacturing process, the photoresist film is baked at high temperature, deposited on the wafer substrate, and then imaged into a circuit pattern after exposure and development. After the etch process, the unexposed photoresist must be removed from the protected area of ​​the wafer so that back-end operations can be performed. [0003] In the manufacturing process, since the photoresist and the substrate are required to have good adhesion, high-temperature baking is usually perfo...

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Problems solved by technology

But it has the following disadvantages at the same time: first, it attacks metals such as copper and aluminum, causing corrosion and fracture of metal lines; second, when NaOH and KOH are used as strippers, although they can peel off the photoresist from the substrate, they cannot play a good role. Dissolution, the film slag produced after peeling is too large, difficult to filter, and easy to block the pipeline during recycling

Patent CN1444103, the stripping solution described is composed of organic solvent, organic base and preservative. Due to the high temperature, the organic solvent and organic base are easy to volatilize, but due to the different volatilization speed, after a period of use, the product components will Changes, so that the degumming ability of the stripping solution declines

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