Copper wire bonding press plate
A bonding and pressing technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as the reduction of the thickness of the bonding pressing plate, the failure of the ball to come off the bond, and the lack of space for the movement of the wire head.
Inactive Publication Date: 2015-05-13
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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Problems solved by technology
[0010] However, due to the large thickness of the bonding platen used in the existing copper wire bonding process, in the case of using a gas protection device, the space for the wire tip of the rivet to move is often insufficient, resulting in the rivet not being able to reach the lead wire during bonding. The base of the frame will cause the ground wire to fail to bond, and during the operation of the machine, there will be abnormal phenomena such as the ball being disconnected and not being connected.
Moreover, the bonding press plate needs to have a certain strength, and the reduction of the thickness of the bonding press plate will cause the reduction of the strength of the pressing plate, so that the bonding requirements cannot be met.
Method used
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[0023] The present invention will now be described in more detail with reference to the accompanying drawings, and in the following description, only specific details such as detailed construction and components are provided to assist the overall understanding of exemplary embodiments of the present invention. Accordingly, those of ordinary skill in the art should recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the invention. Also, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
[0024] figure 1 A cross-sectional view of a copper wire bonding press plate of the present invention is shown.
[0025] figure 2 Shows specific dimensions for a preferred embodiment of the invention
[0026] See attached figure 1 , the bonding press plate 1 of the present invention has a plate body 2, and there are fixing parts 3 on both sides of the pla...
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Abstract
The invention relates to a copper wire bonding press plate. The copper wire bonding press plate comprises a plate body; both sides of the plate body are provided with fixing units for fixing the bounding press plate onto a bonding device; the plate body is provided with a through hole, and during a copper wire bonding process, copper wires penetrate the through hole. The copper wire bonding press plate is characterized in that the thickness of the plate body is smaller than that of a common bonding press plate. The copper wire bonding press plate is made of heat-resisting materials, and the lower surface of the copper wire bonding press plate is provided with an insulating protective layer. The copper wire bonding press plate is smaller than the common bonding press plate in thickness and meanwhile can maintain the hardness, thereby being capable of expanding the space of movement of bonding wire ends during the copper wire bonding process and further improving the yield.
Description
Technical field: [0001] The present invention relates to the technical field of wire bonding, in particular, the present invention relates to a bonding press plate which increases the production yield by increasing the space for the wire head to move during the copper wire bonding process. Background technique: [0002] Wire bonding is the process of pasting the chip electrode face up on the package base, and then using a wire to connect the chip electrode (welding position) to the corresponding electrode bond on the lead frame. [0003] Due to its good electrical conductivity, plasticity and chemical stability, gold wire has always occupied an absolute dominant position in the wire bonding of semiconductor discrete devices, and has the most mature bonding process. However, due to limited resources and expensive gold wires, the industry has been looking for metal materials that can replace gold wires. [0004] As a metal material with low price and rich resources, aluminum ...
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IPC IPC(8): H01L21/67H01L21/603
CPCH01L24/78H01L2224/7855H01L2224/78H01L2924/00012
Inventor 李金刚
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH