Method for manufacturing heat dissipating base plate

Abstract

The invention discloses a method for manufacturing a heat dissipating base plate. The method comprises the steps that the metal base plate comprises one or more heat pipe thinning areas or specific thinning areas, multiple slug grooves are formed in the heat pipe thinning areas or the specific thinning areas by means of stamping, and then another stamping and forging are applied, so that a physical material block in the corresponding heat pipe thinning area or the specific thinning area is punched and forged to fill up the slug grooves to achieve various thinning target values; finally, the heat tube is placed in the heat pipe thinning area, riveted and fixed by means of another stamping and extrusion technique to complete the combination of the heat dissipating base plate. According to the other scheme, the method comprises the steps that permeable areas of one or more heat pipe thinning areas or specific thinning areas are formed on the metal base plate by means of the stamping and forging technique, then a corresponding thin metal sheet with slightly smaller thickness and dimensions is predetermined, a lower die provided with a protrusive rib ring is utilized for applying the stamping and forging to the corresponding permeable area and the metal sheet so as to joint the two, the various thinning target vales are achieved, then the heat tube is placed on the heat tube thinning area, riveted and fixed by means of the another stamping and extrusion technique to complete the combination of the heat dissipating base plate.

Description

technical field [0001] The present invention relates to a heat dissipation bottom plate, in particular to a manufacturing method of a heat dissipation bottom plate with various thinning zones formed by stamping and forging technology of escape trough, or stamping type extrusion filling gap technology. Background technique [0002] The overall thickness of ultra-thin notebook computers (including LED LCD screen + host + chassis itself) has been reduced to less than 15mm by market requirements, among which, except for CPU + motherboard + battery + mechanical hard disk or solid-state semiconductor hard disk In addition to reducing the thickness, the use of thin heat dissipation modules and ultra-thin heat pipes is an extremely important part of the thinning of the NB (notebook computer) mechanism. [0003] In view of this, the inventor filed a Chinese patent application on November 28, 2012, with the application number CN201210501553.6. This patent application discloses a long...

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Problems solved by technology

[0008] In the prior art, these thinned regions are achieved by CNC machining (milling out of numerically controlled lathes), but in practice, turning and milling the above-mentioned heat dissipation thin bottom plate with CNC not only has high cost (requiring a Milling one area at a time), and for the soft aluminum heat dissipation bottom plate with a thickness of only 1mm, there will be difficulties in clamping and the possibility of sticking the knife

In addition, the heat pipe and the heat dissipation thin base plate are combined into a thin plate heat dissipation module. The existing welding technology needs to first plate the aluminum heat dissipation thin base plate with nickel, and then perform high-temperature soldering, which not only greatly increases the cost of the heat dissipation module, but also affects the original thin For an aluminum heat sink with a thickness of 1 mm and a low melting point, maintaining the flatness is even more of a challenge, because the welding process and the residual stress after welding may cause a large deformation of the thin heat sink

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