Fine steel wire production method used for cutting solar-energy-grade silicon wafer

A technology for solar-grade silicon wafers and production methods, which is applied to cleaning equipment for metal extrusion, metal extrusion, and manufacturing tools, etc., can solve the problems of lack of relatively mature technology, increased production costs, and low yield of silicon rods. , to achieve the effect of improving control stability, improving film output rate and improving economic benefits
CN104646441AInactive Publication Date: 2015-05-27邢台钢铁线材精制有限责任公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
邢台钢铁线材精制有限责任公司
Publication Date
2015-05-27
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention provides a fine steel wire production method used for cutting a solar-energy-grade silicon wafer, belonging to the technical field of a steel wire drawing process. The fine steel wire production method is used for producing fine steel wires. According to the technical scheme, the fine steel wire production method comprises the following steps: carrying out three times of acid washing, two times of coating, two times of multi-pass continuous dry type drawing and two times of sorbitic heat treatment by using a special phi5.5mm high sorbite rate disc strip; electroplating brass; and wetly drawing until the length is 0.08-0.12mm. According to the invention, a more fine control method is used for realizing the continuous and stable control of a whole technical process, the production stability and the quality consistency are improved, and waste products are reduced. According to the fine steel wire production method, a process link is increased so that the control stability of the process is improved; the stable drawing of the steel wires with the diameters of 0.08-0.12mm is realized, and the requirements that the cutting of the solar-energy-grade silicon wafer to a steel wire carrier is more and more strict are met; the wafer yield of a silicon rod is improved when the silicon wafer is cut; and the resources are sufficiently utilized, the production cost is reduced and the economic benefits of enterprises are improved.
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Description

technical field

[0001] The invention relates to a production method of fine steel wire, which belongs to the technical field of steel wire drawing technology. Background technique

[0002] At present, silicon wafers for solar cells in new energy power generation are mainly produced by multi-wire cutting, and the cutting technology is developing towards finer wire use, which can reduce the waste of silicon materials, improve the wafer yield and production efficiency. The steel wire used for cutting silicon wafers for solar cells is a fine steel wire, and the fine steel wire is a product produced by a drawing process. In the wire drawing process, as the diameter of the wire decreases, the difficulty of its realization increases geometrically. At present, the production technology of hose steel wire and cord steel wire is basically mature, but it mainly focuses on steel wires with larger specifications such as 0.20mm or more. There is no relatively mature process for the produ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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