Fine steel wire production method used for cutting solar-energy-grade silicon wafer

Abstract

The invention provides a fine steel wire production method used for cutting a solar-energy-grade silicon wafer, belonging to the technical field of a steel wire drawing process. The fine steel wire production method is used for producing fine steel wires. According to the technical scheme, the fine steel wire production method comprises the following steps: carrying out three times of acid washing, two times of coating, two times of multi-pass continuous dry type drawing and two times of sorbitic heat treatment by using a special phi5.5mm high sorbite rate disc strip; electroplating brass; and wetly drawing until the length is 0.08-0.12mm. According to the invention, a more fine control method is used for realizing the continuous and stable control of a whole technical process, the production stability and the quality consistency are improved, and waste products are reduced. According to the fine steel wire production method, a process link is increased so that the control stability of the process is improved; the stable drawing of the steel wires with the diameters of 0.08-0.12mm is realized, and the requirements that the cutting of the solar-energy-grade silicon wafer to a steel wire carrier is more and more strict are met; the wafer yield of a silicon rod is improved when the silicon wafer is cut; and the resources are sufficiently utilized, the production cost is reduced and the economic benefits of enterprises are improved.

Description

technical field [0001] The invention relates to a production method of fine steel wire, which belongs to the technical field of steel wire drawing technology. Background technique [0002] At present, silicon wafers for solar cells in new energy power generation are mainly produced by multi-wire cutting, and the cutting technology is developing towards finer wire use, which can reduce the waste of silicon materials, improve the wafer yield and production efficiency. The steel wire used for cutting silicon wafers for solar cells is a fine steel wire, and the fine steel wire is a product produced by a drawing process. In the wire drawing process, as the diameter of the wire decreases, the difficulty of its realization increases geometrically. At present, the production technology of hose steel wire and cord steel wire is basically mature, but it mainly focuses on steel wires with larger specifications such as 0.20mm or more. There is no relatively mature process for the produ...

AI Technical Summary

Problems solved by technology

At present, the production technology of hose steel wire and cord steel wire is basically mature, but it mainly focuses on steel wires with larger specifications such as 0.20mm or more. There is no relatively mature process for the production of steel wires with thinner diameters. At present, the production of fine steel wires cannot meet the needs of solar-grade silicon wafers. Cutting has more and more stringent requirements for steel wire carriers, which makes the yield of silicon rods lower when cutting silicon wafers, which wastes resources and increases production costs.