Fine steel wire production method used for cutting solar-energy-grade silicon wafer
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 邢台钢铁线材精制有限责任公司
- Publication Date
- 2015-05-27
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention relates to a production method of fine steel wire, which belongs to the technical field of steel wire drawing technology. Background technique
[0002] At present, silicon wafers for solar cells in new energy power generation are mainly produced by multi-wire cutting, and the cutting technology is developing towards finer wire use, which can reduce the waste of silicon materials, improve the wafer yield and production efficiency. The steel wire used for cutting silicon wafers for solar cells is a fine steel wire, and the fine steel wire is a product produced by a drawing process. In the wire drawing process, as the diameter of the wire decreases, the difficulty of its realization increases geometrically. At present, the production technology of hose steel wire and cord steel wire is basically mature, but it mainly focuses on steel wires with larger specifications such as 0.20mm or more. There is no relatively mature process for the produ...