Polymerized stillingia oil for modifying phenolic resin and preparation method of polymerized stillingia oil as well as method for modifying phenolic resin by use of polymerized stillingia oil

Abstract

The invention discloses a polymerized stillingia oil for modifying a phenolic resin and a preparation method of the polymerized stillingia oil as well as a method for modifying the phenolic resin by use of the polymerized stillingia oil. The polymerized stillingia oil is prepared by reacting an expoxized stillingia oil with the maleic anhydride; specifically, the expoxized stillingia oil mixed with an amine catalyst and the maleic anhydride are added in a mass ratio of (95-97): (3-5) to an organic solvent for dissolving and mixing, and then the mixed solution is reacted at a temperature kept within the range of 110-120 DEG C for 2-3 hours to obtain the polymerized stillingia oil for modifying the phenolic resin. The polymerized stillingia oil and an epoxy resin are mixed in a mass ratio of (1-2): (5-12), and then added to the absolute ethyl alcohol; the temperature is increased to the range of 70-80 DEG C until the phenolic resin is completely dissolved, and then reduced to the range of 45-55 DEG C; next, a curing is added, and then cooling is performed after the curing agent is dissolved, and finally, the modified phenolic resin can be obtained. The polymerized stillingia oil is applied to modifying the phenolic resin, and is low in production cost in contrast with the prior art; the modified product is good in performance and wide in application.

Description

technical field [0001] The invention relates to the technical field of toughening agents, in particular to a polymerized catalpa oil toughening agent and the technology of using polymerized catalpa oil to modify phenolic resin. Background technique [0002] Copper clad laminate is an important material in the printed circuit board industry. Copper-clad laminates prepared with pure resins have disadvantages such as brittleness, high water absorption, and low electrical insulation performance, so the resin is generally modified with a toughening agent. [0003] Copper-clad laminate, a paper base material, has the advantages of good punching performance and low price when making printed circuit boards, so it is widely used. The manufacturing process of paper-based copper-clad laminates is: modify the phenolic resin with drying oil (mainly tung oil), then glue the kapok paper and dry it to obtain a prepreg. The prepregs are stacked according to the specified number of sheets, ...

AI Technical Summary

Problems solved by technology

[0008] The first technical problem to be solved by the present invention is to provide a kind of polymerized catalpa oil for modifying phenolic resin to replace tung oil and epoxidized soybean oil in the prior art for the deficiencies in the prior art To solve the technical problems of high price and unstable market of existing toughener products

[0009] The second technical problem to be solved by the present invention is to provide a method for preparing polymerized catalpa oil for modifying phenolic resins in view of the deficiencies in the prior art. The preparation method is simple and the process is easy to control. Catalpa oil can be used to replace tung oil and epoxidized soybean oil toughening agent in the prior art to solve the technical problems of high price and unstable market of existing toughening agent products

[0010] The third technical problem to be solved by the present invention is to provide a method for modifying phenolic resin with polymerized catalpa oil to solve the problem of high price of tung oil or epoxidized soybean oil in the prior art. The resulting copper clad laminate production costs are high and the market supply is unstable