High-precision full-automatic FPC (Flexible Printed Circuit) defect detecting device and detecting process

Abstract

The invention discloses a high-precision full-automatic FPC (Flexible Printed Circuit) defect detecting device and a detecting process. The device comprises an upper computer system and a microscopy detection platform, wherein the upper computer system comprises a motion control module and a microscopy vision control processing module; and the microscopy detection platform comprises an electric precision objective table, a motor control cabinet, a microscopy fixing support, a microscope, a light source and a digital video camera; the detecting process comprises the following steps: comparing the key physical parameters of the FPC in the key procedure with the standard physical parameters, judging that the state of the key procedure is abnormal, and displaying an FPC image with a defect area and specific defect details, thus, the abnormal procedure can be handled timely, rapidly and conveniently by operators. According to the detecting device and the detecting process, the FPC defect detecting efficiency is improved greatly, the false alarm rate is reduced, the defect detection precision is improved, the defect detecting classes are increased, 10-micron order line width and line spacing can be detected, a blind hole and a buried hole can be identified and the automatic level of the FPC production process can be improved effectively.

Description

technical field [0001] The invention relates to the technical field of automatic detection of key manufacturing processes of a flexible circuit board (FPC), in particular to a high-precision full-automatic FPC defect detection device and a detection process. Background technique [0002] The manufacturing process of flexible circuit board (FPC) is relatively complicated. As far as the general manufacturing process is concerned, it needs to go through lamination of copper foil, pasting of photosensitive dry film, laser direct writing exposure, development, etching, film stripping, laser drilling, electroplating, etc. Processes such as copper, solder mask, continuity test and molding. Among them, the key processes mainly include: etching, laser drilling, copper thinning, etc. [0003] In order to improve the stability and yield of FPC manufacturing, in the FPC manufacturing process, the main physical parameters and defects of FPC key processes can be automatically monitored, ...

AI Technical Summary

Problems solved by technology

However, as the line width and spacing are getting smaller and the image density is getting higher and higher, the traditional manual detection cannot meet the needs of the industry due to the long detection time and high false alarm rate.

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