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LED light emitting device

A light-emitting device and LED chip technology, which is applied in the field of LED lighting, can solve the problem that the contact surface between colloid and ceramic is easy to be affected by moisture, etc., and achieve the effects of improving heat dissipation speed and effect, uniform light output, and uniform light pattern distribution

Inactive Publication Date: 2015-05-27
SHANGHAI SANSI ELECTRONICS ENG +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the upper surface of such a lamp holder is generally a planar structure, which will easily cause moisture between the colloid and the ceramic contact surface, and the inventor found that the groove structure avoids this phenomenon.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0037] This embodiment discloses an LED light-emitting device, which includes a package body, an LED chip, and a ceramic carrier for carrying the LED chip. The ceramic carrier is provided with a groove. That is, in the axial direction of the groove from the bottom of the groove to the notch, the radial cross-sectional area of ​​the groove gradually increases, so that the area of ​​the notch is greater than the area of ​​the bottom of the groove. Preferably, the shape of the cavity formed by the groove is the shape of the bottom surface A frustum shape that is smaller than the top surface. The LED chip is located at the bottom of the groove, and the circuit is coated with silver paste on the non-groove part of the ceramic carrier. The LED chip is connected to the circuit through the metal lead out of the groove, and the package is directly stacked on the LED chip to cover the entire groove. The metal leads are encased inside.

[0038] Further, the groove is integrally formed b...

Embodiment 2

[0040] This embodiment discloses an LED light-emitting device, which includes a package body, an LED chip, and a ceramic carrier for carrying the LED chip. The ceramic carrier is provided with a groove. The radial cross section of the groove is quadrangular, and the groove cross section is U-shaped. That is U-shaped groove. The LED chip is located at the bottom of the groove, and the circuit is coated with silver paste on the non-groove part of the ceramic carrier. The LED chip is connected to the circuit through the metal lead out of the groove, and the package is directly stacked on the LED chip to cover the entire groove. The metal leads are encased inside.

Embodiment 3

[0042] This embodiment discloses an LED light-emitting device, which includes a package body, an LED chip, and a ceramic carrier for carrying the LED chip. The ceramic carrier is provided with a groove, and the radial cross-section of the groove is hexagonal. The cross-section (that is, the axial cross-section) is polygonal with the opening part larger than the bottom, the lower half of the groove is used to carry the LED chip, and the side wall of the upper half of the groove is inclined at 45 degrees to the axial direction of the ceramic carrier. The LED chip is located at the bottom of the groove, coated with silver paste on the groove of the ceramic carrier and extended to the side wall of the groove to form a circuit, the LED chip is connected to the circuit on the side wall of the groove through metal leads, and the package is directly stacked on the On the LED chip and wrap the metal leads inside.

[0043] More specifically, the side wall of the groove is composed of an...

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Abstract

The invention provides an LED light emitting device which comprises a package body, an LED chip and a ceramic carrier for carrying the LED chip, wherein a groove is formed in the ceramic carrier; the LED chip is positioned at the bottom of the groove; a circuit is arranged on the ceramic carrier; the LED chip is connected with the circuit through a metal lead; the package body is directly overlapped on the LED chip and wraps the metal lead inside. The LED light emitting device has the benefits that firstly, as the LED chip is directly adhered to the groove of the ceramic carrier through an adhesive, the heat radiation speed is increased, and the heat radiation effect is improved, and as light emitted from the LED chip is reflected secondary through side walls of the groove of the ceramic carrier, the light effect of a whole LED light emitting device is improved; secondly, different angles of the side walls of the groove of the ceramic carrier can play a role in secondary light distribution, so that the light emitting range of the LED light emitting device can meet the lighting requirements of the design, the light distribution can be relatively uniform, and the light can be relatively soft; thirdly, the ceramic carrier can be formed in a pressing manner at a time, the preparation process is simple, and the cost is low.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to LED light emitting devices. Background technique [0002] LED lighting devices are gradually becoming the mainstream lighting fixtures in the market because they can achieve higher illuminance with less power and save energy. Because LED lights are cold light sources, the light color is soft and glare-free, and LED waste products can be recycled. , is a green and energy-saving product; relatively high shock resistance, strong adaptability to ambient temperature, fast start-up, low power, no flicker, and not easy to visual fatigue, so LED lights are widely used in various fields. [0003] However, most of the LED chips of existing LED lamps are welded on the PCB board, and the heat dissipation path of the entire high-efficiency LED lamp is: LED→PCB board (aluminum substrate)→thermal conductive insulating glue→metal shell→outside of the lamp, although the aluminum substrate Such metal ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/64H01L33/54H01L33/60
CPCH01L2224/48091H01L33/486H01L33/54H01L33/60H01L33/641
Inventor 陈必寿何孝亮葛立斌崔佳国
Owner SHANGHAI SANSI ELECTRONICS ENG
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