Treatment device and method for semiconductor
A processing device and processing method technology, which is applied to the surface coating liquid device, semiconductor/solid-state device manufacturing, surface pretreatment, etc., can solve the problem that the needle tip is easy to touch the product, affects the gluing effect, and reduces work efficiency, etc. Problems, to achieve good glue spraying effect, improve work efficiency, and accurate glue output
Active Publication Date: 2015-06-03
SAE TECH DELEVOPMENT DONGGUAN
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Problems solved by technology
First of all, this kind of glue needle needs to be operated manually, which is very inefficient, and the needle tip is easy to touch the product, which affects the effect of gluing; secondly, when curing, the product must be moved to the next workbench, which prolongs the production time. working hours, thereby reducing work efficiency
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[0023] Several different preferred embodiments of the present invention will now be described with reference to the accompanying drawings, wherein like reference numerals in different drawings represent like parts. As mentioned above, the essence of the present invention lies in a semiconductor processing device and processing method, which has high gluing efficiency, accurate gluing position, and automatic curing treatment after gluing on the glue sprayer, thereby realizing efficient processing. The device and the method are applicable to any semiconductor components that need to be bonded by resin adhesives, and are not limited to the field of disk drives.
[0024] Please refer to figure 1 The semiconductor processing device 100 of the present invention includes a glue sprayer 110 , an ultraviolet light emitting device 120 , and a mounting plate 130 for installing the glue sprayer 110 and the ultraviolet light emitting device 120 . The glue spraying machine 110 in this embo...
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The invention relates to a treatment device for a semiconductor. The treatment device comprises a glue sprayer and an ultraviolet emitting device which are mounted on a mounting plate, wherein the glue sprayer comprises a needle cylinder for accommodating a spray material, an impact pin arranged in the needle cylinder in a penetrating manner, and a first control device connected with the impact pin, and the tail end of the impact needle is provided with a nozzle which extends out of the needle cylinder; the ultraviolet emitting device comprises an emitting end part and a second control device for controlling emission of ultraviolet light, wherein the emitting end part is arranged on one side of the nozzle by forming an acute angle with the nozzle, the second control device is connected with the first control device, and after the nozzle sprays glue to a spray region, the emitting end part emits the ultraviolet light to the spray region within a predetermined time so as to cure a glue material. The glue sprayer is high in gluing efficiency and accurate in gluing position, and moreover, the ultraviolet emitting device is automatically cured after the glue sprayer is subjected to gluing, so that efficient treatment is realized.
Description
technical field [0001] The invention relates to a device and a method for processing semiconductor products, in particular to a device and a method for spraying and curing glue on a semiconductor surface to be bonded. Background technique [0002] In the production process of semiconductor products, the bonding between parts is often involved, and there are many kinds of adhesives used for bonding, and UV glue has become one of the most widely used at present due to its safety, economy and good compatibility. of adhesives. UV glue is ultraviolet light curing glue, which is composed of base resin, active monomer, photoinitiator and other main components, as well as auxiliary agents such as stabilizer, crosslinking agent and coupling agent. Under the irradiation of ultraviolet light of appropriate wavelength, the photoinitiator quickly generates free agents or ions, and then initiates the polymerization and crosslinking of the base resin and active monomers to form a network ...
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IPC IPC(8): B05C5/02B05C11/10B05D1/02B05D3/06H01L21/67
Inventor 高寿生陈灿华
Owner SAE TECH DELEVOPMENT DONGGUAN