Reaction chamber heating control method and device

A heating control device and heating control technology, applied in auxiliary controllers with auxiliary heating devices, temperature control using electric methods, etc., can solve problems such as large heating power load, heating and aging lines, and failure of the heating system to work normally , to achieve the effect of reducing adverse effects and heating uniformly

Active Publication Date: 2015-07-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, multiple heaters in the reaction chamber are powered in parallel by sharing a power supply, and if one of them is disconnected, there is no way to prompt
When the set temperature is too high, the load of the heating power su

Method used

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  • Reaction chamber heating control method and device
  • Reaction chamber heating control method and device
  • Reaction chamber heating control method and device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0124] Example one

[0125] The power of the selected single heater 5 is 400w, and the reaction chamber 2 is heated from room temperature to 93℃ for 20 minutes. The required heating power is 1100w, see Figure 7 , Figure 8 Shown.

[0126] Figure 7 Is the temperature measurement data diagram of the reaction chamber 2 before the heater 5 is disconnected, Figure 8 In order to heat to 31mim, one of the other three heaters 5 not located on the side of the main temperature sensor 8 is disconnected from the temperature measurement data map. According to the data analysis in the figure, the temperature difference between the temperature of the main temperature sensor 8 and the temperature of the auxiliary temperature sensor 10 before the heater is disconnected does not exceed a temperature value x, where x is defined according to the experimental results. After one of the other three heaters 5 not located on the side of the main temperature sensor 8 is disconnected, at the 35th minute, ...

Example Embodiment

[0128] Example two

[0129] The power of the selected single heater 5 is 300w, and the reaction chamber 2 is heated from room temperature to 93°C for 20 minutes. The required heating power is 1100w, see Picture 9 , Picture 10 Shown.

[0130] Picture 9 Is the temperature measurement data diagram of the reaction chamber 2 before the heater 5 is disconnected, Picture 10 In order to heat to 31mim, one of the other three heaters 5 not located on the side of the main temperature sensor 8 is disconnected from the temperature measurement data map. According to the data analysis in the figure, the temperature difference between the main temperature sensor and the temperature of the auxiliary temperature sensor before the heater is disconnected does not exceed a temperature value x, where x is defined according to the experimental results. After one of the other three heaters not located on the side of the main temperature sensor 8 is disconnected, at the 35th minute, the difference y be...

Example Embodiment

[0150] As an implementable manner, the comparing unit 220 includes a first comparing subunit 221 and a second comparing subunit 222;

[0151] The first comparison subunit 221 is used to determine the main temperature sensor 8 side when the temperature x1 of the main temperature sensor 8 is greater than the temperature x2 of the auxiliary temperature sensor 10, and the temperature difference between the two is greater than twice the preset temperature difference x If there is no failure of the heater 5 of the other three heaters 5, and at least one heater 5 of the other three heaters 5 has a failure, the first failure alarm signal that the other heaters 5 are disconnected is issued;

[0152] The second comparison sub-unit 222 is used to determine that the heater 5 on the side of the main temperature sensor 8 is faulty when the temperature x1 of the main temperature sensor 8 is less than the temperature x2 of the auxiliary temperature sensor 10, and send out heating on the side of the...

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PUM

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Abstract

The invention provides a reaction chamber heating control method and device. The method comprises the following steps: arranging at least two temperature sensors at the bottom of a reaction chamber, and detecting the temperature of the reaction chamber; judging that a heater arranged on the reaction chamber is disconnected according to temperature detected by at least two temperature sensors; when the temperature sensor serving as a reaction chamber temperature control point fails, switching the other temperature sensor which is not used as the reaction chamber temperature control point as a new reaction chamber temperature control point to control the reaction chamber temperature. According to the method and the device, the disconnection of the heater can be judged, and the adverse effect of the entire heating control device during failure of the temperature sensor serving as the reaction chamber temperature control point is reduced.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a heating control method and device for a reaction chamber. Background technique [0002] The precise temperature control of the plasma reaction chamber plays a crucial role in the results of the etching process. The etching process is very sensitive to temperature, which directly affects the uniformity of the etching rate and the uniformity of the morphology, and can reduce the side effects of the reaction chamber. Particle deposition on the wall promotes the timely discharge of volatile residues from the reaction chamber, which can effectively extend the period of preventive maintenance of the chamber. [0003] In the etching process, the reaction chamber is usually heated, and in order to control the uniformity of temperature, multiple heaters are usually used to heat different regions of the reaction chamber. However, in the prior art, multiple heaters in the reaction chamber a...

Claims

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Application Information

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IPC IPC(8): G05D23/30
Inventor 张孟湜
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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