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Capacitive touch screen and manufacturing method thereof

A technology of capacitive touch screen and production method, which is applied in the fields of electrical digital data processing, instrumentation, calculation, etc., can solve the problems of module assembly difficulty, FPC length, etc., and achieve the effects of saving man-hours, improving molding efficiency, and reducing costs

Active Publication Date: 2015-07-01
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under normal circumstances, to calculate the coordinates of the finger position, a bridging structure or a double-layer wiring structure is required. In the production of existing medium and large-sized full ITO touch screens, it is difficult to assemble modules later because the FPC is too long.

Method used

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  • Capacitive touch screen and manufacturing method thereof
  • Capacitive touch screen and manufacturing method thereof
  • Capacitive touch screen and manufacturing method thereof

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Embodiment Construction

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0024] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the descrip...

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Abstract

The invention discloses a manufacturing method of a capacitive touch screen and the capacitive touch screen manufactured by the method. The method includes that a transparent substrate is selected, an antireflection layer that is made of silicon dioxide is plated on the transparent substrate, a transparent electrode layer is designed on the antireflection layer, an insulating layer that covers a part of the transparent electrode layer is printed on the transparent electrode layer, a conducting circuit layer is designed after the printing of the insulating layer is finished, finally, an ACP conductive adhesive layer is designed on the conducting circuit layer and then small piece formation is performed, a part of conductive electrodes in the conducting circuit layer is formed by means of silk screen printing, and the other part of conductive electrodes in the conducting circuit layer is formed by means of laser dry etching. According to the capacitive touch screen and the manufacturing method thereof, the length of a flexible circuit board on the capacitive touch screen is reduced, and the forming efficiency of the capacitive touch screen is increased.

Description

technical field [0001] The invention relates to the field of touch screen manufacturing, in particular to a manufacturing method of a capacitive touch screen and a capacitive touch screen manufactured by the method. Background technique [0002] In the existing technology, the structure of the integrated capacitive touch screen (OGS-OLS) is mainly composed of a transparent protective substrate with a decorative layer, indium tin oxide (Indium Tin Oxide, ITO for short), etc. When the finger touches, the finger and the ITO The surface forms a coupling capacitance, which causes a change in the capacitance of the touch point, thereby calculating the position of the finger. [0003] The transparent conductive circuit layer is generally directly plated on the transparent substrate, and the electrode leads are distributed around the transparent conductive circuit layer. Under normal circumstances, to calculate the coordinates of the finger position, a bridging structure or a doubl...

Claims

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Application Information

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IPC IPC(8): G06F3/044
Inventor 万娅鹏陈学刚
Owner 深圳市合力泰光电有限公司
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