Automatic placement machine

Abstract

The invention discloses a full-automatic sheet mounter which comprises a machine frame. A sapphire sheet processing part and a ceramic disc processing part are arranged on the machine frame. The ceramic disc processing part is provided with a ceramic disc baking working position and a sheet mounting device. The sheet mounting device is arranged above the ceramic disc baking working position. The ceramic disc baking working position is provided with a ceramic disc baking table and a dividing plate device. The ceramic disc baking table is arranged on the machine frame in a rotatable mode. The dividing plate device and the ceramic disc baking table are in transmission connection, so that the dividing plate device drives the ceramic disc baking table to rotate by a certain angle. The sapphire sheet processing part comprises a bearing basket fixing mechanism and a wax coating device. The bearing basket fixing mechanism is provided with a plurality of bearing basket fixing working positions for locating bearing baskets. The wax coating device is provided with a wax throwing mechanism and a wax dripping mechanism. The wax throwing mechanism is provided with a sapphire sheet placing rotating table. Automatic wax dripping sheet mounting of sapphire sheets can be achieved, and the finished product rate and the sheet mounting efficiency are improved.

Description

technical field [0001] The invention relates to a fully automatic placement machine. Background technique [0002] At present, with the rapid development of optoelectronic technology, the demand for sapphire substrate materials for optoelectronic products is increasing day by day; at the same time, with the continuous expansion of LED components, sapphire has become one of the most important substrate materials and has a huge domestic and foreign markets. need. However, due to important applications in aerospace, military, etc., the processing technology of sapphire wafers is extremely secret in Western countries. The sapphire processing process is as follows: a blanking → b peripheral grinding → c peripheral chamfering → d bevel grinding → e plane Grinding → f mirror polishing → g cleaning. In the prior art, manual operation is often used in the intermediate process of e → f. The manual process is to use the polishing disc to place the ceramic polishing disc in an oven to ...

AI Technical Summary

Problems solved by technology

[0003] It is difficult to control the uniformity of waxing on the polishing disc manually, and it is a waste of time and wax cost for mirror polishing (after the polishing disc is cooled to room temperature, remove the heavy objects, and use a cotton ball to pick up the solvent to remove excess wax around the wafer. The polishing wax is wiped clean), and the efficiency of manual waxing is very low

Manually place the sapphire wafer on the polishing wax at a certain temperature and knead gently until there are no air bubbles between the wafer and the polishing wax. This manual pressing requires high technical skills for workers, and the efficiency is low and the quality is unstable.

And the polishing disc has a certain temperature, which is also a hidden danger to the safety of the operators. If it is operated manually, the yield of the patch is relatively low, and it is time-consuming and laborious.

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