A vacuum suction pen with a retractable suction head

Abstract

The invention relates to a surface mounting tool during the production of electronic products, in particular to a vacuum suction pen with a telescopic suction head. The vacuum suction pen comprises a DC voltage regulating circuit, a vacuum pump and a suction pen assembly, wherein the suction pen assembly consists of an upper cap of the suction pen, a penholder, and a lower cap of the suction pen, and an air opening is formed in the top end of the upper cap of the suction pen and is communicated with the extraction opening of the vacuum pump through a silica-gel hose; a light spring and the telescopic suction head are arranged in the penholder, the upper part of the telescopic suction head is of a sealing structure matched with the inner cavity of the penholder or the upper end surface of the lower cap of the suction pen, the straight-tube section at the lower part of the telescopic suction head stretches out from a through hole in the middle of the lower cap of the suction pen, and the lower end of the straight-tube section at the lower part of the telescopic suction head is a conical connector for being matched and connected with a medical syringe needle. While in use, when an element is in contact with solder paste, the vacuum suction pen disclosed by the invention has a good strength feeling, the pressure is uniform, the surface of the element and the surface of the solder paste can be tightly attached, and rosin joints and cold solder can be avoided; the vacuum suction pen is convenient to use, simple in operation and high in pasting speed.

Description

technical field [0001] The invention relates to a surface mounting tool in the production process of electronic products, in particular to a vacuum suction pen with a retractable suction head. Background technique [0002] With the widespread use of surface mount components in electronic products, surface mount technology has developed rapidly, and automatic placement machines are generally used for surface component installation in large-scale production processes. But in the process of product testing and small batch production, manual placement also plays an important role. [0003] At present, in the process of manual placement, large-volume patch components are picked up and placed with tweezers, and small-volume patch components such as 0805, 0603, 0402 resistors, capacitors, etc., are picked up and placed with ordinary vacuum suction pens. Pick and place. When in use, the vacuum pump is energized to work, and its suction port is connected with the hose and the sucti...

AI Technical Summary

Problems solved by technology

[0004] The problem with this kind of vacuum suction pen is that when holding the suction pen with one hand, the index finger or middle finger should pinch the vent hole when picking up the component, and the vent hole must be loosened when releasing the component. It is difficult to operate without practice.

On the other hand, the thickness of the solder paste on the pad is generally only 0.1 ~ 0.2mm, and the component surface and the solder paste surface should be closely attached without gaps, and its strength is difficult to control

When the pressure is low, the component surface and the solder paste surface cannot be closely bonded, and there is a gap, which is likely to cause virtual soldering

When the pressure is high, the component will break away the solder paste, so that there is no solder paste between the component and the pad, which will easily cause false soldering

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