Packaging sandwich antenna with function of gap embedded phase amplitude calibration

Abstract

The invention provides a packaging sandwich antenna with a function of gap embedded phase amplitude calibration, and relates to a horn antenna. The antenna comprises micro-strip feeder line (1), a horn antenna (2) and gaps (3), wherein the micro-strip feeder line (1), the horn antenna (2) and the gaps (3) are integrated on a dielectric substrate (4); the dielectric substrate (4) is located on the inner layer of a three-dimensional package (5); one end of the micro-strip feeder line (1) is connected with an internal circuit (8) through a coplanar waveguide (7) on the packaging side surface; the horn antenna (2) comprises a bottom surface metal plane (9), a top surface metal plane (10) and metallized via hole horn side walls (11); a middle gap (16), a left gap (17) and a right gap (18) are formed in the bottom surface metal plane (9) and the top surface metal plane (10); four sub-horns are arranged in the horn antenna (2), one end of each sub-horn faces the micro-strip feeder line (1), and the other end of each sub-horn is closer to but does not reach an antenna aperture surface (12). With the adoption of the antenna, the antenna gain can be improved.

Description

Technical field [0001] The invention relates to a horn antenna, in particular to a packaged sandwich antenna with a phase amplitude calibration embedded in a slot. Background technique [0002] Using the stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, for which it is also necessary to integrate the antenna on the package. The antenna is usually integrated on the surface of the package, for example, the patch antenna is integrated on the top of the package. But sometimes it is necessary to integrate the antenna in a mezzanine in the middle of the package to meet the needs of the system. If the horn antenna is integrated in the interlayer inside the package, the above requirements can be achieved. However, usually horn antennas are non-planar, are incompatible with planar circuit technology, and have larger geometric dimensions, which limits their application in packaging structures. In ...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the aperture electric field intensity is uneven, and the radiation directivity and gain decrease. In addition, the amplitude of the electromagnetic field on the aperture surface is also very uneven, with a large middle The two sides are small, which also affects the radiation performance of the antenna

At present, methods such as dielectric loading and dielectric prism have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the inconsistency between the horn antenna and the free space wave impedance on the aperture surface, nor can they improve the amplitude distribution of the electromagnetic field on the aperture surface. Uniformity, and these phase alignment structures increase the overall structural size of the antenna, which is not suitable for integration into the interlayer of the package

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