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Epoxy resin composition, cured product of same, and light emitting diode

A technology of epoxy resin and composition, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of easy damage to colorless transparency, etc., and achieve excellent heat resistance and coloring, increased viscosity increase speed, and increased viscosity The effect of low magnification

Active Publication Date: 2015-07-15
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The colorless transparency of the cured product obtained by using the above-mentioned curing agent tends to be impaired, so it is not suitable for sealing materials of photoelectric conversion elements such as high-brightness LEDs.

Method used

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  • Epoxy resin composition, cured product of same, and light emitting diode
  • Epoxy resin composition, cured product of same, and light emitting diode
  • Epoxy resin composition, cured product of same, and light emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0175] 79.0 parts by mass of H-TMAn [manufactured by Mitsubishi Gas Chemical Co., Ltd.], 21.0 parts by mass of a mixture of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride [manufactured by Shin Nippon Chemical Co., Ltd. MH700G], alicyclic Formula epoxy resin compound [3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexene carboxylate: CEL2021P manufactured by Daicel Corporation] 172 parts by mass, as glycidyl ester type epoxy Resin compound diglycidyl hexahydrophthalate [SR-HHPA manufactured by Sakamoto Pharmaceutical Co., Ltd.] 73.9 parts by mass, hindered phenolic antioxidant AO-50 (manufactured by ADEKA Corporation) 2.8 parts by mass, and quaternary phosphonium 0.80 parts by mass of bromine salt "U-CAT5003" manufactured by San-Apro Ltd. was mixed to obtain an epoxy resin composition. The physical property measurement and evaluation of the obtained epoxy resin composition and its hardened|cured material were performed by the method mentioned above. The results...

Embodiment 2～16 and comparative example 1～9

[0177]Except having changed the kind and ratio of a raw material component as shown in Tables 1-3, it carried out similarly to Example 1, and obtained the epoxy resin composition. The physical property measurement and evaluation of the obtained epoxy resin composition and its hardened|cured material were performed by the method mentioned above. The results are shown in Tables 1-3.

[0178] [Table 1]

[0179]

[0180] [Table 2]

[0181]

[0182] [table 3]

[0183]

[0184] From the above-mentioned Tables 1 to 3, the following matters can be understood.

[0185] It can be seen that for containing acid anhydride (A) and epoxy resin (B), and acid anhydride (A) contains cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride 30 to 90% by mass, epoxy resin ( B) An epoxy resin composition containing 30 to 90% by mass of an alicyclic epoxy resin compound, a glycidyl ester type epoxy resin compound, and a compounding equivalent ratio of an acid anhydride to an epoxy resin in th...

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Abstract

This epoxy resin composition contains an acid anhydride (A) and an epoxy resin (B), and is characterized in that (a) the acid anhydride (A) contains 30-90% by mass of cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, (b) the epoxy resin (B) contains 30-90% by mass of an alicyclic epoxy resin compound and a glycidyl ester epoxy resin compound, and (c) the blending equivalent ratio of the acid anhydride to the epoxy resin, said blending equivalent ratio being represented by formula (1), is within the range of 0.4-0.7. Blending equivalent ratio of acid anhydride to epoxy resin = (X + Y) / Z (1) X: the number of functional groups of the acid anhydride groups contained in the acid anhydride (A) Y: the number of functional groups of the carboxyl groups contained in the acid anhydride (A) Z: the number of functional groups of the epoxy groups contained in the epoxy resin (B)

Description

technical field [0001] The invention relates to an epoxy resin composition, its cured product and a light emitting diode. Background technique [0002] In recent years, high-brightness blue and white light-emitting diodes (hereinafter also abbreviated as "LEDs") have been developed, and their applications have expanded to bulletin boards, full-color displays, backlights for mobile phones, and the like. Conventionally, acid anhydride-curable epoxy resins are excellent in colorless transparency, and therefore have been used as sealing materials for photoelectric conversion elements such as LEDs. [0003] As a curing agent for the epoxy resin used in the sealing material of the above-mentioned photoelectric conversion element, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, Alicyclic acid anhydrides such as hydrogen phthalic anhydride. [0004] When the epoxy resi...

Claims

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Application Information

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IPC IPC(8): C08G59/42C08G59/22H01L33/56
CPCC08G59/42H01L33/56H01L33/501C08G59/22C08G59/226C08G59/24C08G59/4215
Inventor 和田友孝
Owner MITSUBISHI GAS CHEM CO INC
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