Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-interface bus converting expanding chip design

A technology for expanding chips and bus conversion, applied in the direction of instruments, electrical digital data processing, etc., can solve problems such as reducing the flexibility and scalability of system applications, and increasing the complexity of system software and hardware design.

Active Publication Date: 2015-07-22
CHENGDU WEIKAI MICROELECTRONICS CO LTD
View PDF5 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the commonly used interface buses in electronic systems include USB, IIC, SPI, UART, CAN, LIN and parallel interfaces. General interface bus conversion and expansion devices adopt a single architecture mode to realize one interface bus to another interface The conversion or expansion of the bus, with the increase of peripherals used in the system, the number and types of peripheral interface buses are increasing. When the system is applied to multiple interfaces, it is necessary to use a variety of devices to achieve expansion Reduces the complexity of system software and hardware design, reduces the flexibility and scalability of system applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-interface bus converting expanding chip design
  • Multi-interface bus converting expanding chip design
  • Multi-interface bus converting expanding chip design

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0044] Such as figure 1 As shown, a multi-interface bus conversion expansion chip includes: main interface module, main interface data processing logic, clock generator, power management module, dual-port large-capacity RAM memory, chip internal controller, expansion interface data processing logic, interrupt Processing logic, expansion interface module.

[0045] Among them, such as figure 2As shown, the main interface module includes: the external transceiver logic of the main interface module, the main interface controller, the main interface conversion logic, and the internal transceiver logic of the main interface module, which are connected together through the local bus of the main interface module. The main interface controller is connected to the main interface mode line and the main interface switching logic, and connected to the local b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of data transmission and converting and particularly relates to a multi-interface bus converting expanding chip. The shortcoming that an existing chip can only convert and expand one kind of interfaces is overcome. The functions of different interface converting and various interface bus expanding are achieved. The requirements for different interface bus converting and expanding between main control CPUs, between a main control CPU and a peripheral and between peripherals are met. The chip comprises a main interface module, a main interface data processing logic part, a clock generator, a power supply management module, a double-interface large-capacity RAM storage, a chip inner controller, an expanding interface data processing logic part, an interrupt processing logic part and an expanding interface module. The expanding interface module can be configured to be 1-8 interfaces of different kinds flexibly. The chip has the advantages that converting and expanding between any main interface bus and expanding interface bus and between any expanding bus interfaces can be achieved, intelligent protocol processing is carried out through data, a unified data package format is formed for storing and processing, and the large-capacity double-interface RAM in the chip guarantees stored data.

Description

technical field [0001] The invention relates to an interface bus chip, in particular to a multi-interface bus conversion expansion chip. Background technique [0002] In computer, automation and embedded systems, the CPU needs to control and connect various peripherals. If the interface of the CPU is not enough or not compatible with the peripheral interface, the interface bus extension and conversion chip are needed to expand the interface bus. and convert. [0003] At present, the commonly used interface buses in electronic systems include USB, IIC, SPI, UART, CAN, LIN and parallel interfaces. General interface bus conversion and expansion devices adopt a single architecture mode to realize one interface bus to another interface The conversion or expansion of the bus, with the increase of peripherals used in the system, the number and types of peripheral interface buses are increasing. When the system is applied to multiple interfaces, it is necessary to use a variety of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F13/38
Inventor 赵广宇
Owner CHENGDU WEIKAI MICROELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products