Unlock instant, AI-driven research and patent intelligence for your innovation.

Long-distance AD (Analog/Digital) sampling circuit based on LVDS (Low Voltage Differential Signaling) and SIP (Serial Peripheral Interface) buses

A technology of SPI bus and sampling circuit, applied in the direction of electrical components, electrical signal transmission system, signal transmission system, etc., can solve the problem that the communication rate is difficult to meet the sampling requirements, so as to improve compactness and integration, reduce device cost, enhance The effect of flexibility

Inactive Publication Date: 2015-07-22
BEIJING CREATIVE DISTRIBUTION AUTOMATION
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the SPI bus is mainly used for long-distance communication on the PCB board. When doing inter-board or long-distance communication on the board, the communication rate is difficult to meet the sampling requirements.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Long-distance AD (Analog/Digital) sampling circuit based on LVDS (Low Voltage Differential Signaling) and SIP (Serial Peripheral Interface) buses
  • Long-distance AD (Analog/Digital) sampling circuit based on LVDS (Low Voltage Differential Signaling) and SIP (Serial Peripheral Interface) buses
  • Long-distance AD (Analog/Digital) sampling circuit based on LVDS (Low Voltage Differential Signaling) and SIP (Serial Peripheral Interface) buses

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] refer to Figure 1 to Figure 3 , the long-distance AD ​​sampling circuit based on LVDS and SPI bus is specifically implemented as follows:

[0017] 1) The CS signal of the SPI bus of the CPU is connected to the DI pin of LVDS1, the CS signal of the SPI bus of the AD is connected to the RO pin of LVDS1, and the LVDS1 and LVDS2 driver chips are interconnected in accordance with the LVDS bus electrical specification.

[0018] 2) The SPI bus SCLK signal of the CPU is connected to the DI pin of LVDS3, the SPI bus SCLK signal of the AD is connected to the RO pin of LVDS4, and the LVDS3 and LVDS4 driver chips are interconnected in accordance with the LVDS bus electrical specification.

[0019] 3) The SPI bus SDO and SDI signals of the CPU are connected to the DI and RO pins of LVDS5 in turn, and the SPI bus SDI and SDO signals of AD are connected to the RO and DI pins of LVDS5 in turn. The LVDS5 and LVDS6 driver chips follow the LVDS bus electrical specification interconnecte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a long-distance AD (Analog / Digital) sampling circuit based on LVDS (Low Voltage Differential Signaling) and SIP (Serial Peripheral Interface) buses. An LVDS bus circuit capable of performing long-distance high-speed digital communication between PCBs (Printed Circuit Boards) or on a PCB is connected between an SPI bus interface on a PCB where a CPU (Central Processing Unit) is positioned and an SPI bus interface on a PCB where an AD sampling chip is positioned in order that the CPU can realize direct sampling control and digital communication for long-distance AD sampling chips outside the PCBs or on the PCBs, so that additional CPU chips needing to be arranged on an AD sampling board are saved. Through adoption of the design, the cost of an electric power automatic protection device is reduced; the integration degree is increased; and the aim of the invention is fulfilled. Through practical application to a low-cost power distribution automatic protection product, the feasibility and reliability of the circuit and the timeliness and high degree of sampling speed are proved.

Description

technical field [0001] The present invention relates to a circuit design in which a CPU controls an AD chip to realize digital sampling in a power protection device, especially the long-distance control and sampling of the AD sampling chip where the CPU is located outside the PCB board, or the board is relatively far away. circuit design. technical background [0002] In the field of power system automation, digital protection and automation control devices are mainly used for protection monitoring of power lines, circuit breakers, transformers and other power facilities and control of stable operation of the power grid. An embedded computer system designed for the core processing unit, as well as a series of other peripheral electronic components such as AD sampling chips and memory. After years of development and application, the design of these devices increasingly requires low cost and integration, while the protection target or scope is constantly increasing. Traditio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H03M1/54
Inventor 朱磊杨天林张涛张自民杜永杰周志丰
Owner BEIJING CREATIVE DISTRIBUTION AUTOMATION
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More