Method for making blind slots of buried copper blocks in circuit boards

A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of height difference of heating components and affect the heat dissipation effect of heating components, and achieve the effect of improving the heat dissipation effect

Active Publication Date: 2018-01-16
GCI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional way of making blind grooves on copper blocks by CNC milling machine has the following disadvantages: the existing PCB equipment cannot meet the processing requirements, and CNC machine tools for professional metal processing are required; CNC milling machine processing requires cooling oil or coolant After cooling, professional cleaning equipment is required to clean the buried copper circuit board; after CNC machine tool processing, milling cutter marks will be left in the blind slot, and height differences are prone to occur when heating components are mounted, which affects the heat dissipation effect of heating components

Method used

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  • Method for making blind slots of buried copper blocks in circuit boards
  • Method for making blind slots of buried copper blocks in circuit boards
  • Method for making blind slots of buried copper blocks in circuit boards

Examples

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Embodiment Construction

[0037] refer to figure 1 , 3 , a method for manufacturing a circuit board buried copper block blind slot, comprising the steps of:

[0038] S100: cleaning the surface of the circuit board; microetching the surface of the copper block 40; drying the surface of the circuit board.

[0039] S200: attaching a photosensitive resist film 50 on one side of the copper block 40 embedded in the circuit board;

[0040] S300: Covering the position of the photosensitive resist film 50 corresponding to the copper block 40 where the blind groove 110 needs to be opened, and irradiating other positions of the photosensitive resist film 50 with light to undergo a polymerization reaction;

[0041] S400: removing the position of the photosensitive resist film 50 corresponding to the copper block 40 where the blind groove 110 needs to be opened, through a developing reaction, to expose the copper surface;

[0042] S500: Spray an etchant on the copper surface to etch the blind groove 110 .

[00...

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Abstract

The invention discloses a method for manufacturing blind grooves embedded in copper blocks of circuit boards, comprising the following steps: attaching a photosensitive resist film to one side of the circuit board where the copper blocks are embedded; The position is blocked, and the other positions of the photosensitive resist film are polymerized by light irradiation; the position of the photosensitive resist film corresponding to the copper block that needs to open a blind groove is removed by developing reaction, and the copper surface is exposed; the etching solution is sprayed on the copper surface to etch out Blind slot. By using the photosensitive resist film after polymerization to protect the part of the circuit board that does not need to open the blind slot, the depth of the blind slot can be well controlled by etching, and the uniformity of the etching is used to make the wall of the blind slot after etching flat, thereby solving the problem. It solves the problem of milling cutter printing on the bottom of blind slots traditionally processed by CNC machine tools, improves the heat dissipation effect of heating components in the later stage, and completely solves the problem of unclean cleaning of copper PCB surface cooling oil and coolant after milling slots.

Description

technical field [0001] The invention relates to circuit board technology, in particular to a method for manufacturing a blind slot of a circuit board embedded copper block. Background technique [0002] With the development of the electronics industry, the volume of electronic products is getting smaller and smaller, and the power density is getting bigger and bigger. The problem of heat dissipation is particularly important. Make a depth-controlled blind slot on the copper block, and mount the heating components directly into the blind slot of the copper block. The heat is conducted through the copper block to meet the heat dissipation requirements. However, the traditional way of making blind grooves on copper blocks by CNC milling machine has the following disadvantages: the existing PCB equipment cannot meet the processing requirements, and CNC machine tools for professional metal processing are required; CNC milling machine processing requires cooling oil or coolant Af...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 宣光华李金鸿
Owner GCI SCI & TECH
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