Printed circuit board and processing method thereof

Abstract

The invention is applied to the technical field of a printed circuit board, and provides a processing method of a printed circuit board and a printed circuit board formed by use of the processing method, for the purpose of solving the problems that since local electroplating thick gold processing is carried out after external-layer etching processing, a local electroplating thick gold position cannot be conductive and lead wires cannot be added to a part of the printed circuit board in the prior art. The processing method of the printed circuit board comprises the following step of providing a plate substrate, an external-layer pattern, pattern electroplating, nickel plating, thin gold plating, external-layer local electroplating gold pattern processing, the local electroplating thick gold processing and external-layer etching. According to the processing method, before the external-layer etching processing, the external-layer local electroplating gold pattern processing and the local electroplating thick gold processing are carried out, so that conductive lead wires are additionally arranged on an external-layer line pattern, the whole copper foil layer of the plate substrate can be conductive, the membrane removing operation is simple, the manufacturing efficiency is improved, and the processing period is shortened.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a processing method of a printed circuit board and a printed circuit board formed by the processing method. Background technique [0002] With the continuous upgrading of electronic products, the surface treatment of printed circuit boards is becoming more and more complicated. Usually, multiple surface treatments are required on the same printed circuit board, which makes the processing of printed circuit boards more difficult. [0003] The common surface treatment of printed circuit boards is to adopt the method of thin gold on the whole board and thick gold on some parts. The specific manufacturing process: lamination→outer layer drilling→outer layer copper sinking→full board electroplating→outer layer circuit pattern →Graphic copper plating→nickel plating→thin gold plating→outer layer etching→solder resist→outer layer local electro-gold graphics→loc...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of processing method of printed circuit board, by carrying out local electric thickness gold treatment before outer layer etching treatment, aim to solve the problem of partial electric thick gold treatment after outer layer etching treatment in the prior art. The problem that the thick gold position cannot conduct electricity and some printed circuit boards cannot add wires

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