Semiconductor factory control separation blade management method

Abstract

The invention belongs to the technical field of block control wafer management, and particularly relates to a semiconductor factory block control wafer management method which comprises the following steps: S1, detection of a brand-new wafer block control wafer: detecting whether the block control wafer produced by a brand-new wafer is qualified or not through a detection device, storing the block control wafer into a standby library if the block control wafer is qualified, and if the block control wafer is not qualified, storing the block control wafer into the standby library; if not, the gear control piece is stored in a waste warehouse; through a series of treatment such as chemical corrosion, grinding and polishing, cleaning and the like on the recycled gear control wafer, the gear control wafer has the functions of testing and stabilizing the stability of a machine table again, the loss of the gear control wafer is greatly reduced, the situation that a brand new gear control wafer is used every time is avoided, the use cost of the gear control wafer is reduced, and the production efficiency is improved. And the gear control pieces with different qualities are graded, so that the gear control pieces with different qualities can be applied to different manufacturing procedures, the quality influence of the gear control pieces can be reduced to the minimum, and the gear control pieces can be recycled for more times.

Description

technical field [0001] The invention belongs to the technical field of control sheet management, in particular to a control sheet management method for semiconductor factories. Background technique [0002] In the wafer manufacturing process, the control sheet and the blocking sheet play the role of monitoring and testing and maintaining stability, and are necessary components. As the process progresses, the demand for the blocking control sheet has a tendency to expand. [0003] The fineness of the wafer production is extremely high, and the flatness of the silicon wafer surface is directly related to the quality of the chip. Therefore, it is necessary to monitor and test the performance of the manufacturing equipment at all times and maintain stability. However, these tests and maintenance of stability are destructive. The cost of direct use of the product is high, so it is generally used instead of a block and a control sheet. The control sheet is mainly used to monitor w...

AI Technical Summary

Problems solved by technology

[0005] In order to make up for the deficiencies of the existing technology, most of the existing sources of control chips are new wafers and recycled wafers, but the regenerated control chips have not been classified into quality levels, so that good quality control chips are applied to the back-end Or in the manufacturing process that is more likely to be polluted, the quality of the control sheet is damaged and scrapped, which in turn causes the problem of increased loss of the control sheet. The semiconductor factory control sheet management method proposed by the present invention

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