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Rotating planar target for efficiently cooling

A rotating plane, high-efficiency technology, applied in the field of plane targets, can solve the problems of weak magnetic field of circular plane cathode targets, the distribution uniformity and cooling effect need to be improved, the sputtering rate and target utilization rate are low, etc.

Inactive Publication Date: 2015-08-05
苏州求是真空电子有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] With the development of magnetron sputtering coating technology, researchers are mainly working in these two directions. One is to improve the utilization rate of the target by improving the uniform distribution of the magnetic field on the target surface, and the other is to increase the magnetic field strength and improve the cooling design by densely packed magnets. To improve the sputtering rate of the target; the circular planar cathode target magnetic field of the existing magnetron sputtering device is weak, the distribution uniformity and cooling effect need to be improved, and the sputtering rate and target utilization rate are low; the prior art has not yet solved these problems question

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  • Rotating planar target for efficiently cooling
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Embodiment Construction

[0021] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0022] A high-efficiency heat-dissipating rotating planar target 4, comprising: a cooling pool 1, a magnetic steel rotating device 2 placed in the cooling pool 1, a target 4 fixed on the cooling pool 1, and a fixed connection between the cooling pool 1 and the target 4 The fixing device is arranged on the cathode electrode 6 at the bottom of the cooling pool 1 .

[0023] The cooling pool 1 includes: the body of the cooling pool 1 wrapping the magnetic steel rotating device 2, the cooling water pipe 11 running through the magnetic steel rotating device 2, the cooling water outlet pipe 121 fixed on the body of the cooling pool 1 and placed at the bottom of the magnetic steel rotating device 2 , 122. A shaft seal ring 13 is sleeved at the contact between the cooling pool 1 and the cooling water pipe 11 . The cooling water pipe 11 runs thro...

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Abstract

The invention discloses a rotating planar target for efficiently cooling. The rotating planar target comprises a cooling pool, a magnetic steel rotating device positioned in the cooling pool, a target fixed on the cooling pool, a fixing device for fixedly connecting the cooling pool with the target, and a cathode electrode arranged at the bottom of the cooling pool. In order to further improve the uniformity of a magnetic field, enhance the strength of the magnetic field and improve the cooling effect of the target, the invention provides a rotating planar target for efficiently cooling; on the one hand, the uniform sputtering area of the target is enlarged to further improve the target utilization rate and accelerate the sputtering speed; and on the other hand, the surface magnetic field strength of the target and the cooling effect of the target are improved to realize quicker film coating and uniform and quick large-area film deposition; and the rotating planar target for efficiently cooling has excellent application foreground.

Description

technical field [0001] A planar target, in particular a rotating planar target with high heat dissipation. Background technique [0002] As a coating device, the magnetron sputtering device has been widely used in various electronic and decorative coating fields. It has the advantages of fast coating rate, low temperature deposition, and no pollution. [0003] With the development of magnetron sputtering coating technology, researchers are mainly working in these two directions. One is to improve the utilization rate of the target by improving the uniform distribution of the magnetic field on the target surface, and the other is to increase the magnetic field strength and improve the cooling design by densely packed magnets. To improve the sputtering rate of the target; the circular planar cathode target magnetic field of the existing magnetron sputtering device is weak, the distribution uniformity and cooling effect need to be improved, and the sputtering rate and target ut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 冯斌金浩王德苗李东滨
Owner 苏州求是真空电子有限公司