an optical device

Abstract

An embodiment of the present invention provides an optical device, which relates to the field of optical communication and can meet the impedance matching requirements of high-frequency signal transmission. The optical device includes: a first substrate, a second substrate and an adapter plate; a first conductive path is provided on the upper surface of the first substrate, and a second conductive path is provided on the lower surface of the first substrate; the upper surface of the second substrate A third conductive path is provided; a microstrip line structure is provided on the transfer board, and the microstrip line structure includes a transfer line arranged on the upper surface of the transfer board; the upper surface of the second substrate is opposite to the lower surface of the first substrate, Wherein the second conductive path is bonded to the third conductive path, the adapter plate is arranged above the upper surface of the second substrate, and is located between the third conductive paths; one end of the transfer line is electrically connected to the first conductive path by bonding , the other end of the transfer line is connected to the internal components of the optical device by bonding. Embodiments of the present invention are used in optical device fabrication.

Description

technical field [0001] The invention relates to the field of optical communication, in particular to an optical device. Background technique [0002] The development of optical modules and optical devices in the field of optical communication is very rapid. With the construction of a large number of FTTH (Fiber To The Home, fiber directly to the home) and 3G / 4G networks in China, the demand for optical modules and optical devices is increasing. Therefore, optical modules and optical devices with high development speed, long transmission distance, miniaturization and low power consumption have become the focus of equipment manufacturers and device manufacturers. [0003] Among them, in order to adapt to the miniaturization of optical devices, packaged lasers and other electrical devices are usually used as optical devices, and the lasers and other electrical devices packaged inside are connected to the external PCB (Printed Circuit Board, printed circuit board) circuit board ...

AI Technical Summary

Problems solved by technology

Among them, since the external PCB circuit board supplies power to the laser and other components through the conductive path between the PCB board and the laser and other components, the impedance matching design of each conductive path has a greater impact on the high-frequency signal input to the laser.

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