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Micromachined ultra-small piezoresistive pressure sensor and manufacturing method thereof

A pressure sensor, piezoresistive technology, applied in the field of micromechanical piezoresistive pressure sensors

Active Publication Date: 2018-01-12
日照金慧科技信息咨询有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manufacturing pressure sensors of this small size can be a challenge in mass production

Method used

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  • Micromachined ultra-small piezoresistive pressure sensor and manufacturing method thereof
  • Micromachined ultra-small piezoresistive pressure sensor and manufacturing method thereof
  • Micromachined ultra-small piezoresistive pressure sensor and manufacturing method thereof

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Embodiment Construction

[0023] Several preferred embodiments according to the invention will be described in detail below with reference to the accompanying drawings.

[0024] Figure 1A and Figure 1B A method of manufacturing a miniature pressure sensor and a method of manufacturing one or more piezoresistive pressure sensors 10 using micro-electromechanical system (MEMS) technology are reflected. Figure 1A Shown is a top view of a piezoresistive pressure sensor. Figure 1B Shown is a cutaway view of a piezoresistive pressure sensor. Figure 1B The sectional view is along the Figure 1A Cut in line 1A-1A'.

[0025] The pressure sensor 10 is formed by covering the cavity 11 with a diaphragm membrane 13 . Figure 1A The dashed lines in represent the edges 16 of the cavity 11 and the cavity region 11 thus formed. The piezoresistor 12 is formed on top of the diaphragm 13 inside the cavity 11 formed by diffusion or ion implantation. When pressure is applied on top of the diaphragm 13, the diaphr...

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Abstract

The present invention provides a method for fabricating one or more ultra-small piezoresistive pressure sensors on a silicon wafer. The diaphragm of the piezoresistive pressure sensor is formed by fusion bonding. Piezoresistive pressure sensors can be formed by silicon deposition, photolithography, and etching processes.

Description

technical field [0001] The present invention mainly relates to a micromechanical piezoresistive pressure sensor, in particular to a micromechanical ultra-miniature piezoresistive pressure sensor for low-voltage applications and a manufacturing method thereof. The sensor uses a wafer bonding technique to form a silicon diaphragm on an etching chamber and methods of deep silicon etching to define the profile of the sensor to be fabricated. Background technique [0002] It is well known that during medical treatment, when vascular diagnosis or treatment is performed on a subject, monitoring physiological parameters at fixed points in the body can provide key information for medical professionals regarding the condition of the subject. Intracoronary blood pressure is a particularly important and beneficial physiological parameter. Studies have shown that point-of-point blood pressure within coronary arteries can be used to calculate fractional flow reserve (FFR), which represen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/06B81C1/00B81B7/02
Inventor 漆斌
Owner 日照金慧科技信息咨询有限公司