Copper alloys for electrical and electronic equipment, copper alloy sheets for electrical and electronic equipment, conductive components and terminals for electrical and electronic equipment

Abstract

The copper alloy for electrical and electronic equipment according to the present invention contains more than 2 mass % and less than 23 mass % of Zn, 0.1 mass % to 0.9 mass % of Sn, 0.05 mass % to less than 1.0 mass % of Ni, and 0.001 mass % % to less than 0.10% by mass of Fe, 0.005% by mass to 0.1% by mass of P, and the remainder consists of Cu and unavoidable impurities, and in terms of atomic ratio, satisfies 0.002≤Fe / Ni<1.5, 3< (Ni+Fe) / P<15, 0.3<Sn / (Ni+Fe)<5, and the ratio R{220} of the X-ray diffraction intensity from the {220} plane on one surface is 0.8 or less.

Description

technical field [0001] The present invention relates to a Cu-Zn-Sn based copper alloy for electrical and electronic equipment used as a conductive element for electrical and electronic equipment such as a connector of a semiconductor device, other terminals, or a movable conductive sheet or a lead frame of an electromagnetic relay. Copper alloy sheets for electrical and electronic equipment, conductive components and terminals for electrical and electronic equipment. [0002] This application claims priority based on Patent Application No. 2012-288052 for which it applied in Japan on December 28, 2012, and uses the content for this specification. Background technique [0003] Cu-Zn alloys have been used as raw materials for electrical and electronic equipment such as connectors of semiconductor devices, other terminals, movable conductive sheets or lead frames of electromagnetic relays, from the viewpoint of strength, processability, and cost balance. widely used. [0004]...

AI Technical Summary

Problems solved by technology

[0016] However, in Patent Documents 1 and 2, only the individual contents of Ni, Fe, and P are considered, and it is not always possible to reliably and sufficiently improve the stress relaxation resistance simply by adjusting these individual contents.

[0017] In addition, although Patent Document 3 discloses adjusting the Ni / Sn ratio, the relationship between the P compound and the stress relaxation resistance is not considered at all, and the improvement of the stress relaxation resistance cannot be sufficiently and reliably achieved.

[0018] In addition, in Patent Document 4, sufficient improvement in stress relaxation resistance cannot be achieved only by adjusting the total amount of Fe, Ni, and P and the atomic ratio of (Fe+Ni) / P.

[0019] As described above, conventionally proposed methods cannot sufficiently improve the stress relaxation resistance of Cu-Zn-Sn alloys

Therefore, in the connector with the above-mentioned structure, the residual stress relaxes over time or in a high-temperature environment, so that the contact pressure with the conductive member on the opposite side cannot be maintained, and there is a problem that defects such as poor contact are likely to occur at an early stage.

In order to avoid this problem, in the past, the wall thickness of the material had to be increased, resulting in an increase in material cost and weight

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