Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive part and terminal for electrical and electronic equipment

Abstract

The present invention pertains to a copper alloy for electrical and electronic equipment, a copper alloy thin sheet for electrical and electronic equipment, and a conductive part and terminal for electrical and electronic equipment. The copper alloy for electrical and electronic equipment contains more than 2.0 mass% but less than 23.0 mass% of zinc, 0.10 mass% to 0.90 mass% of tin, 0.05 mass% to less than 1.00 mass% of nickel, 0.001 mass% to less than 0.100 mass% of iron, and 0.005 mass% to 0.100 mass% of phosphorus, with the remainder comprising copper and unavoidable impurities. The copper alloy satisfies 0.002 ≤ Fe / Ni < 1.500, 3.0 < (Ni + Fe) / P < 100.0, and 0.10 < Sn / (Ni + Fe) < 5.00 in terms of atomic ratios. The content of hydrogen is not more than 10 mass ppm, the content of oxygen is not more than 100 mass ppm, the content of sulfur is not more than 50 mass ppm, and the content of carbon is not more than 10 mass ppm.

Description

technical field [0001] The present invention relates to a Cu-Zn-Sn series copper alloy for electrical and electronic equipment used as a conductive element for electrical and electronic equipment such as a connector of a semiconductor device, other terminals, or a movable conductive sheet of an electromagnetic relay, or a lead frame. The copper alloy thin plate for electronic and electrical equipment of the copper alloy for electronic and electrical equipment, a conductive element and a terminal for electronic and electrical equipment. [0002] This application claims priority based on Patent Application No. 2012-282680 filed in Japan on December 26, 2012 and Patent Application No. 2013-252330 filed in Japan on December 5, 2013, and the contents thereof are incorporated herein by reference. middle. Background technique [0003] Cu—Zn alloys have conventionally been widely used as raw materials for the above-mentioned electric and electronic conductive elements from the view...

AI Technical Summary

Problems solved by technology

[0016] However, in Patent Documents 1 and 2, only the individual contents of Ni, Fe, and P are considered, and it is not always possible to reliably and sufficiently improve the stress relaxation resistance simply by adjusting these individual contents.

[0017] In addition, although Patent Document 3 discloses adjusting the Ni / Sn ratio, the relationship between the P compound and the stress relaxation resistance is not considered at all, and the improvement of the stress relaxation resistance cannot be sufficiently and reliably achieved.

[0018] In addition, in Patent Document 4, sufficient improvement in stress relaxation resistance cannot be achieved only by adjusting the total amount of Fe, Ni, and P and the atomic ratio of (Fe+Ni) / P.

[0019] As described above, conventionally proposed methods cannot sufficiently improve the stress relaxation resistance of Cu-Zn-Sn alloys

Therefore, in the connector with the above-mentioned structure, the residual stress relaxes over time or in a high-temperature environment, so that the contact pressure with the conductive member on the opposite side cannot be maintained, and there is a problem that defects such as poor contact are likely to occur at an early stage.

In order to avoid this problem, in the past, the wall thickness of the material had to be increased, resulting in an increase in material cost and weight

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