Defect observation method and defect observation device

A technology for observing devices and defects, applied in measuring devices, image data processing, instruments, etc., can solve problems such as failure of defect detection, inability to recognize periodic patterns, inability to synthesize reference images, etc., and achieve the effect of high-precision defect detection
CN104870985AActive Publication Date: 2015-08-26HITACHI HIGH-TECH CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HITACHI HIGH-TECH CORP
Publication Date
2015-08-26

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Abstract

Cases in which defects are analyzed in a manufacturing process stage in which a pattern is not formed or in a manufacturing process in which a pattern formed on a lower layer does not appear in the captured image are increasing. However, in these cases, there is a problem of not being able to synthesize a favorable reference image and failing to detect a defect when a periodic pattern cannot be recognized in the pattern. In the present invention, a defect occupation rate, which is the percentage of an image being inspected occupied by a defect region, is found, it is determined whether the defect occupation rate is higher or lower than a threshold, and, in accordance with the determination results, it is determined whether to create, as the reference image, an image comprising pixels having the average luminance value of the luminance values of a plurality of pixels contained in the image being inspected. In particular, when the defect occupation rate is low, an image comprising pixels having the average luminance value of the luminance values of a plurality of pixels contained in the image being inspected is used as the reference image.
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Description

technical field

[0001] The invention relates to a defect observation method and a defect observation device in a semiconductor manufacturing process. Background technique

[0002] In the semiconductor manufacturing process, in order to ensure a high yield, it is important to detect defects that occur in the manufacturing process early and take countermeasures.

[0003] SEM (Scanning Electron Microscope, Scanning Electron Microscope) type defect observation device (also called defect review device) is a device specially used to observe defects generated in the semiconductor manufacturing process, and generally detects defects detected by the upper defect inspection device A device that observes images of coordinates with higher quality than higher-level defect inspection devices. Specifically, the sample stage is moved to the defect coordinates output from the upper-level defect inspection device, and an image is taken at a low magnification such that the defect to be observ...

Claims

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