Plastic packaging type IPM module installing structure

A mounting structure, plastic-encapsulated technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem of lead frame not being in contact with solder joints, product waste, etc., to reduce virtual welding or welding dislocation risk, improve reliability, and reduce the difficulty of process operation

Inactive Publication Date: 2015-09-02
XIAN YONGDIAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Generally speaking, the distance between the pins of the lead frame 10' soldered to the PCB circuit board 30' is very small, and some are less than 1mm. Therefore, in the process of assembling the PCB circuit board 30' and the lead frame 10', as long as there is A slight displacement will cause the lead frame to fail to contact the solder joints, resulting in a waste product

Method used

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  • Plastic packaging type IPM module installing structure
  • Plastic packaging type IPM module installing structure
  • Plastic packaging type IPM module installing structure

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Embodiment Construction

[0025] The invention discloses a plastic-encapsulated IPM module installation structure. The installation structure includes a lead frame group, a DBC board and a PCB circuit board that are fixedly installed and electrically connected with the lead frame group, and the DBC board and the PCB circuit board are electrically connected to each other. Setting, the PCB circuit board is provided with a plurality of welding holes, and the lead frame group is provided with a plurality of welding pins corresponding to the welding holes, and the PCB circuit board and the lead frame group are welded and fixed through the welding holes and the welding pins.

[0026] Preferably, the lead frame group includes a first lead frame group and a second lead frame group, the first lead frame group is welded and fixed to the DBC board, and the second lead frame group is welded and fixed to the PCB circuit board.

[0027] Preferably, the welding pins are arranged on the second lead frame group.

[002...

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Abstract

The invention discloses a plastic packaging type IPM module installing structure. The installing structure comprises a lead frame group. The installing structure further comprises a DBC plate and a PCB circuit board which are fixedly installed and electrically connected with the lead frame group. The DBC plate and the PCB circuit board are arranged in a mutually electrically connected way. A plurality of welding holes are arranged on the PCB circuit board. Welding pins corresponding to the welding holes are arranged on the lead frame group. The PCB circuit board and the lead frame group are welded and fixed through the welding holes and the welding pins. The risks of insufficient solder or welding dislocation due to simultaneous welding of multiple pins of the lead frame group can be lowered. The technical operation difficulties are alleviated. Product reliability is further improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a plastic-encapsulated IPM module installation structure. Background technique [0002] Plastic-encapsulated IPM (Intelligent Power Module, Intelligent Power Module) is a new type of control module that integrates the IGBT chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability, and easy use. It is widely used in frequency conversion home appliances, inverter power supplies, industrial control and other fields, and its social and economic benefits are considerable. [0003] In the prior art, refer to figu...

Claims

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Application Information

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IPC IPC(8): H01L23/495
CPCH01L2924/13055H01L2224/48091H01L2224/48137H01L2224/48247H01L2224/49111H01L2924/00014H01L2924/00
Inventor 吴磊王富珍
Owner XIAN YONGDIAN ELECTRIC
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