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Encapsulating composition, barrier layer including same, and encapsulated apparatus including same

一种封装装置、组合物的技术，应用在涂层、图纹面的照相制版工艺、半导体/固态器件零部件等方向，能够解决粘附力劣化、防水性能退化等问题

Active Publication Date: 2015-09-02
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This may cause deterioration of the adhesive force between the organic layer and the inorganic layer, thus causing deterioration of waterproof performance

Method used

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  • Encapsulating composition, barrier layer including same, and encapsulated apparatus including same
  • Encapsulating composition, barrier layer including same, and encapsulated apparatus including same
  • Encapsulating composition, barrier layer including same, and encapsulated apparatus including same

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0113] Preparation Example 1: Preparation of monomer represented by formula 2

[0114] In a 1000 ml flask provided with a cooling tube and a stirrer, 30 mg of hydroquinone, 50 g of DL-lactic acid (TCI Chemicals), and 86.98 g of 2-isocyanatoethyl methacrylate were stirred at 0°C , while slowly adding 100 mg of dibutyltin dilaurate thereto. The flask was heated to 50°C, followed by stirring for 4 hours. 127 g of the monomer represented by Formula 2 was obtained. The obtained compound has a HPLC purity of 97%.

[0115] [Formula 2]

[0116]

preparation Embodiment 2 to 4

[0117] Preparation Examples 2 to 4: Preparation of Monomers Represented by Formulas 3 to 5

preparation Embodiment 2

[0118] Monomers represented by formulas 3 to 5 were prepared in the same manner as in Preparation Example 1, except that 4-hydroxycyclohexanecarboxylic acid (Preparation Example 2), 2-hydroxybenzoic acid (Preparation Example Example 3), and 4-hydroxy-3-nitrobenzoic acid (Preparation Example 4) instead of DL-lactic acid.

[0119] [Formula 3]

[0120]

[0121] [Formula 4]

[0122]

[0123] [Formula 5]

[0124]

[0125] Details of components used in Examples and Comparative Examples are as follows.

[0126] (A) Photocurable monomers: (A1) tetraethylene glycol diacrylate, (A2) decanediol diacrylate, (A3) pentaerythritol tetraacrylate (Aldrich Chemical)

[0127] (B) Photocurable monomers containing carboxylic acid groups: (B1) the monomer represented by Formula 2 in Preparation Example 1, (B2) the monomer represented by Formula 3 in Preparation Example 2, ( B3) the monomer represented by Formula 4 in Preparation Example 3, (B4) the monomer represented by Formula 5 in P...

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Abstract

The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.

Description

technical field [0001] The present invention relates to an encapsulating composition, a barrier layer comprising the same, a barrier stack comprising the same, an encapsulating device comprising the same, and a method of encapsulating a device using the same. More particularly, the present invention relates to an encapsulation composition comprising a specific monomer, thus having high adhesion to an inorganic barrier layer and providing enhanced reliability, thereby enabling the use in encapsulation of devices susceptible to environmental influences a barrier stack comprising the same; a barrier stack comprising the same; a packaged device comprising the same; and a method of packaging a device using the same. Background technique [0002] Organic optoelectronic devices such as organic light emitting diodes, devices including photovoltaic cells, and displays such as organic thin film transistors must be encapsulated to protect their sensitive elements from airborne gases, m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/04C08F20/34H01L23/29H10K99/00
CPCC08L33/14H01L23/3121H01L2924/0002H01L23/3135C08F220/36C08F2220/365H01L23/293C09D4/00C08F220/365Y02E10/549C08F220/346H10K59/873H01L2924/00C08F20/34C08L33/04G03F7/037H01L23/29H01L31/048H10K50/844H10K85/141H10K2102/00H10K2102/351
Inventor 南成龙权智慧李莲洙李知娟李昌珉赵玟行崔承集河京珍
Owner CHEIL IND INC