Etching solution composition for copper layer and titanium layer and method of preparing array substrate for liquid crystal display using the same

Abstract

The invention discloses an etching solution composition for a copper layer and a titanium layer and a method of preparing an array substrate for a liquid crystal display using the same. The etching solution composition comprises persulphate and sulfosalicylic acid, so that the multiple metallic layers including copper layers and titanium layers can be uniformly etched in at a high speed in an environmental-friendly way. Excellent thermal control performance and time stability are ensured.

Description

technical field [0001] The invention relates to an etchant composition for a copper layer and a titanium layer, and a method for manufacturing an array substrate of a liquid crystal display using the etchant composition. Background technique [0002] A representative electronic circuit for driving semiconductor devices and flat panel displays is a thin film transistor (TFT). A method of manufacturing a TFT-LCD generally includes forming a metal layer on a substrate as a wire material for a gate electrode and a source / drain electrode, forming a photoresist on a selected area of ​​the metal layer, and then using The photoresist acts as a mask to etch the metal layer. [0003] Conventionally, as the wiring material of the gate electrode and the source / drain electrodes, metal layers in which aluminum or its alloy and other metals are sequentially laminated have been used. Aluminum is cheaper and has low electrical resistance, but has poor chemical resistance and can cause prob...

AI Technical Summary

Problems solved by technology

In this case, however, the etch profile is poor and post-processing is difficult

In particular, fluoride ions (F -

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