Non-contact glass micro-nano structure processing method

A processing method and non-contact technology, applied in the field of preparing micro-nano structures, can solve the problems of harsh etching line width and expensive patterning, and achieve the effect of simplifying the process cost

Active Publication Date: 2015-09-23
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a non-contact glass micro-nano structure processing method for the problems of expensive patterning and harsh etching line width in the traditional glass etching method

Method used

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  • Non-contact glass micro-nano structure processing method
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  • Non-contact glass micro-nano structure processing method

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Embodiment Construction

[0018] see figure 1 , the specific steps of the embodiment of the present invention are given below:

[0019] Step 1: The glass sheet 01 is placed on the Z-axis mobile platform 04 and connected to the negative pole of the power supply 06; the conductive material 07 is made of semiconductor silicon material, processed into a needle-like shape by micro-nano etching technology, and the conductive material 07 is placed on the glass sheet 01 , fixed on the X-Y plane mobile platform 11, and connected to the positive pole of the power supply 06; turn on the heating device 03 to heat the glass sheet 01 to between 250°C and 500°C; change the distance value between the glass sheet 01 and the conductive material 07 a; and adjust the voltage value of the power supply 06 to U to break down the atmosphere medium 05 and form an arc 08. Taking air as an example, the distance value a between the glass sheet 01 and the conductive material 07 and the voltage value U of the power supply 06 satis...

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Abstract

A non-contact glass micro-nano structure processing method relates to a method for preparing the micro-nano structure. According to the method, a glass sheet is put on a Z axis mobile platform and is connected with a power supply cathode, and a conductive material is put above the glass sheet, is fixed on an X-Y plane mobile platform and is connected with a power supply anode; a heating unit is started, the distance between the conductive material and the glass sheet is adjusted, an atmosphere medium is punctured so as to form an electric arc, so that six parts, namely the anode, conductive material, atmosphere medium, glass sheet, cathode and power supply, form a loop, and an electric heating modification process is started; and the X-Y plane mobile platform moves in an X-Y plane and drives the conductive material to move in the X-Y plane according to a preset processing pattern so as to process the glass sheet to obtain a patterning electric heating modification structure, the glass sheet with the patterning electric heating modification structure is put in an HF solution so as to be etched, and as the etching speed of the electric heating modification structure on the glass sheet is faster than that of the unmodified area, and the etched glass sheet is processed so as to obtain the required micro-nano structure.

Description

technical field [0001] The invention relates to a method for preparing a micro-nano structure, in particular to a non-contact glass micro-nano structure processing method. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) have been widely used in aerospace, automotive, communication and medical fields. Since micro-sensors, micro-actuators and micro-actuators are the core of micro-electromechanical systems, the preparation process of micro-devices has become the key to MEMS manufacturing. [0003] As a typical material for making MEMS devices, glass is widely used in microbial sensors, optical devices, and sensor packaging. Traditionally commonly used glass micro-nano structure processing methods include sandblasting etching (Zheng Yu, Wang Ya, Ding Guifu. High reliability glass sandblasting micromachining technology based on flexible mask[J]. Nanotechnology and Precision Engineering, 2012,10 (6):563-568.), inductively coupled plasma etching (Zhang Mingc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 王凌云杨秉臻占瞻吴珍孙道恒
Owner XIAMEN UNIV
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