Flat connection CPU cooling and dust removal device

Abstract

The invention discloses a flush joint CPU radiating and dust removal device. A radiator is fixed to a CPU. A fan is fixedly arranged on the radiator. An integrated component composed of the fan, a cone cylinder, a cylinder and a cyclone achieves flush joint face fitting. The cyclone is fixed to a machine box plate through a supporting foot and provided with a plurality of tangential air inlets. Electrostatic fibers are arranged inside the cone cylinder and the cylinder. A shaft is fixedly arranged on the machine box plate. The front end of the shaft is connected with the small end of a tower-shaped spring. A rotatable valve retainer is connected with the large end of the tower-shaped spring and flexibly matched with the shaft through a shaft sleeve. The rotatable valve retainer is provided with a stroke control sliding groove. The tower-shaped spring will expand when the temperature is high and drives the rotatable valve retainer to rotate. A vent hole in the machine box plate coincides with the vent hole of the rotatable valve retainer. The tower-shaped spring with the high thermal expansion coefficient, the electrostatic fibers with the proper density and length, the cyclone and other technologies are effectively integrated, dust removal and automatic cold air guiding cooling and radiating are achieved, and the computer working reliability and stability are improved.

Description

technical field [0001] The invention relates to a heat dissipation and dust removal device, in particular to a flat connection type CPU heat dissipation and dust removal device. Background technique [0002] The computer is a very popular office equipment in today's society. It is generally composed of a chassis and a monitor. There are many electronic components combined in the chassis. Among them, the CPU consumes a lot of power and generates a lot of heat. Other components also have corresponding power consumption and heat. Therefore, good heat dissipation of the computer is particularly important. [0003] For CPU heat dissipation, fans and radiators with large air volume are usually configured to circulate air in the chassis. A small part of the heat in the chassis is diffused to the environment through natural convection on the outer wall of the chassis, and most of the heat is unified by the fan of the power box Draw out, and at the same time realize the ventilation ...

AI Technical Summary

Problems solved by technology

[0004] In practical applications, if the environment is dusty and the temperature is high, the temperature of the entire computer will be high, which will easily cause failure and damage

Generally, the CPU fans of computers have more wind power, but due to the large amount of dust attached to the fan blades, the fan speed decreases, the load increases, and the cooling effect decreases; in addition, due to the large amount of dust attached to the radiator surface and circuit board, the heat dissipation The increase of thermal resistance leads to high temperature of electronic components, especially in summer, and the combination of multiple factors leads to poor cooling effect of the computer, which causes the temperature of the computer to be high and the work is prone to instability.

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