A flexible substrate bending device and method
A flexible substrate and bending technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of easy damage of packaged devices, poor bending accuracy and consistency, and easy rebound of patch glue, and achieve savings. Production cost, high bending accuracy, good consistency
Inactive Publication Date: 2017-08-29
GUANGDONG DANBOND TECH
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Problems solved by technology
[0005] The bending technology for flexible substrate folding multi-layer multi-chip packaging devices currently has manual technology, but the manual bending efficiency is low, the bending accuracy and consistency are poor, and the patch adhesive is easy to rebound when it is not cured; bending (folding) ) Tool equipment technology, currently only the patent CN1703768A is disclosed. Although this patent can achieve large-scale production and high efficiency, it has low cutting accuracy and the risk of easy damage to packaged devices when the packaged devices are divided after bending and curing.
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[0042] The preferred embodiments of the invention will be further described in detail below.
[0043] figure 1 and 2 As shown, a planar package device 100 without bending package according to an embodiment of the present invention, such as a single-chip FC-BGA (Flip Chip Ball Grid Array flip-chip ball grid array package). The planar packaging device 100 includes a flexible substrate 110, a first chip 1201, a second chip 1202 and a third chip 1203, wherein the flexible substrate 110 includes a first part 1401, a second part 1402 and a third part 1403, and the first part 1401 passes through the third part 1403 is connected to the second part 1402, and the first part 1401, the second part 1402 and the third part 1403 are respectively electrically connected to the first chip 1201, the second chip 1202 and the third chip 1203.
[0044]The flexible substrate 110 can be a double-sided flexible circuit board with polyimide in the middle and copper trace conductive layers on both sid...
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The present invention discloses a flexible substrate bending device and a method thereof. The device comprises a pressing mechanism, a supporting mechanism, a first roller and a second roller. The supporting mechanism and the pressing mechanism are opposite to each other and can move toward each other and move away from each other. The first roller and the second roller are opposite to each other and can roll toward each other and roll away from each other. The first roller, the second roller and the supporting mechanism are used for supporting the first part, the second part and the third part of a flexible substrate. The third part is between the first part and the second part. The pressing mechanism and the supporting mechanism are used for moving together to drive the third part to move to the same side of the first roller and the second roller until the first part and the second part have angles with the third part. The first roller and the second roller are also used for moving toward each other to bend the first part and the second part to the third part when the pressing mechanism is separated from the third part. The device and the method have high bending precision and high efficiency.
Description
【Technical field】 [0001] The invention relates to the field of semiconductors, in particular to a flexible substrate bending device and method. 【Background technique】 [0002] In recent years, with the development of semiconductor technology and the development of various terminal products such as mobile phones and digital cameras in the direction of lightness, thinness, shortness, smallness and high performance, the feature size of ICs has been continuously reduced and the degree of integration has been continuously improved. Difficulties, in this case, an advanced packaging technology - 3D (three-dimensional) packaging technology emerged in the IC manufacturing industry. 3D packaging technology is a high-density electronic packaging technology developed in the three-dimensional direction (Z-axis) on the basis of X-Y plane two-dimensional packaging. Compared with traditional two-dimensional packaging, it has smaller packaging volume, weight, delay, noise and Power consumpt...
Claims
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IPC IPC(8): H01L21/02H01L21/67
Inventor 刘萍杨永远
Owner GUANGDONG DANBOND TECH